Industry Directory | Manufacturer
Shenzhen Honreal Technology Co., focus on global Surface Mount electronic assembly field for 15 years. Specializing in providing various brands of SMT pick and place machines and spare parts. Fuji, Panasonic, Juki, Hitachi, Yahama
Industry Directory | Manufacturer
ECM's technology focus is electronic circuit fabrication which compliments EMS's circuit assembly product line.
New Equipment | Curing Equipment
A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications. PCO pressurizes air into a rigid vessel and heats & cools with
Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti
Electronics Forum | Wed Feb 15 14:03:25 EST 2006 | samir
Robert McKeown Company makes thermally conduct Al tape. KIC did a study on which method (Kapton Tape, Aluminum Tape, Hi-Temp Solder) is the most repeatable. The study can be found in their website: http://www.kicthermal.com Al Tape placed 2nd, and
Electronics Forum | Thu Dec 15 17:30:42 EST 2005 | GS
Yes Davef, storage condition and long time remaining on shelf could effect pealing strength, but we experimented that by using Polystirene Carrier Tape also this problem was reduced almost to zero. Df, If I am not wrong when you talk about pr
Used SMT Equipment | Pick and Place/Feeders
Universal Instruments Polaris Machine For Sale Very clean and in Good Condition See attached pictures and information below Polaris Model Number: 7514A Equipment Number: 10076306 Year 2008 Travel: 550 mm x 800mm Repeatability: +/- 0.01
Used SMT Equipment | Pick and Place/Feeders
FUJI-NXT III NXT III Scalable Placement Platforms The NEW NXT III is a highly productive, multi-functional modular placing machine. Built for speed, it features a faster XY robot and tape feeders, as well as a new H24 head that achieves 35,000 chips
Industry News | 2010-12-07 14:53:07.0
GPD Global announces that its Positive Cavity Displacement (PCD) technology is proven with silver-filled electrically and thermally conductive adhesives.
Industry News | 2011-09-21 12:11:34.0
GPD Global will showcase its Positive Cavity Displacement (PCD) 'H' Series high resolution pumps in Booth #133 at the upcoming SMTA International Conference & Exhibition.
Parts & Supplies | Tape and Reel
SMT Kapton Tape Polymide film tape Specifications: Antistatic Thermally conductive Polyimides for fine line circuitry Cryogenic insulation Corona resistant Pigmented for color Conformable Other films tailored to meet customers needs Param
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Parts & Supplies | Assembly Accessories
137037 Arcom-8-Channel DEK-CHANNEL-MONIOR-181507 181507 EIDEN Channel TV modulator 121B Furnace temperature teste KIC 2000 profile 9 channel Furnace temperature tester ..KIC 2000 profile 9 channel KIC
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
General curing, die attach curing, underfill curing, film & tape bonding, wafer laminating.
http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to
Training Courses | | | IPC J-STD-001 Space Trainer (CIT)
The IPC J-STD-001 Space Addendum (CIT) certification courses allow individuals to conduct Certified IPC J-STD-001 Space Addendum Specialist (CIS) training.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Wed Mar 18 00:00:00 EDT 2020 - Wed Mar 18 00:00:00 EDT 2020 | College Park, Maryland USA
CALCE Reliability Science Symposium - Spring 2020
Career Center | , | 2018-02-12 15:39:39.0
MR PCB Rework Technician (Intel Contract Employee) Job Description The IMR PCB rework Technician will be responsible for developing thermal profiles for PCB components, identifying nozzles, revision control, updating/drafting rework instructions,
Career Center | , | 2018-02-13 11:01:27.0
Job Description The IMR PCB rework Technician will be responsible for developing thermal profiles for PCB components, identifying nozzles, revision control, updating/drafting rework instructions, performing soldering workmanship within IPC standards
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Career Center | , Florida USA | Engineering,Management,Quality Control,Research and Development,Technical Support
Resourceful, innovative professional with over 15 years in the Electronic Industry, with domestic and international experience. Expertise in initiating projects and programs that boost efficiency and productivity while expanding employee education.
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/fluid-types/conductive-adhesives
. Thermally and electrically conductive epoxy-based fluids are required to mechanically bond die to the substrate, to make an electrical ground plane connection, and to conduct heat away from the die
Imagineering, Inc. | https://www.pcbnet.com/blog/what-are-aluminum-printed-circuit-boards-used-for/
– A layer of thermally conductive material insulates the board from stress caused by heat. This layer is often made of ceramic polymer and is sandwiched between the circuit and base layers. Base Layer
