Electronics Forum | Wed May 22 10:27:42 EDT 2019 | Matt
thanks again for the feedback were your cracks mostly visible in relation to images shown in the document here: https://www.digikey.ca/en/pdf/t/tdk/guide-flex-cracking-mlcc most of our cracking has been lengthwise across the body which from what i
Electronics Forum | Mon Jul 12 13:06:32 EDT 1999 | Earl Moon
| I had parts replaced on SMT PWBs and the repair created measling defects. | Reliability Question: | Q1. Can measling be aggrevated or grow over time due to | temperature cycling and moisture. Customer environment is | -62C to +85C. | | Thank
Electronics Forum | Wed Jun 13 21:31:27 EDT 2001 | davef
Lotsa ways to bust caps. First: placement force; Second: thermal stress; Third: poor pad design. Forth: then, ummm maybe the cap supplier. Please describe the crack in more detail. Where does the crack start? Where does the crack go?
Electronics Forum | Wed Oct 23 15:33:38 EDT 2002 | Randy V.
Dye penetrant is a liguid that will wick through very small cracks. I used over 10 years ago for checking cracks in glass feedthru's in hermetic packages. You put the dye on one side of the seal and developer (white) on the other side and the red dye
Electronics Forum | Wed Oct 09 08:36:44 EDT 2002 | pjc
Operation features of many devices, machine components, instruments depend substantially on state of their surfaces. Selective surface processing by high-intensity energy beam (ion, electron, laser treatment) is one of the most perspective directions
Electronics Forum | Fri May 31 10:15:30 EDT 2019 | davef
Major sources of crack in the solder connection after thermal cycling are: * Thermal heating caused by differences in thermal expansion between the board and the component * Lead-free solder is more rigid and brittle than eutectic solder in simila
Electronics Forum | Fri Feb 13 08:54:43 EST 1998 | justin medernach
| Hi , | I have not been able to find any good description on how to perform double sided reflow on PCBs.The best would of course be to avoid reflowing the bottom side again but in real life this is not possible. | So when double sided reflow sol
Electronics Forum | Wed Aug 08 17:50:22 EDT 2007 | flipit
X7R >Z5U,Y5V Greater means less likely to crack or in other words NP0 is better than X7R for crack resistance. Don't think that there is a set formula. There isn't! I cracked ceramic resonators at 0.050" from the board edge with CAB M2 and M3 dep
Electronics Forum | Thu Aug 15 09:36:48 EDT 2019 | davef
It could be delamination of the layered material of the MLCC caused by thermal shock or a component fabrication defect. For more on MLCC cracks: https://www.avx.com/docs/techinfo/CeramicCapacitors/cracks.pdf
Electronics Forum | Mon Jun 24 22:15:56 EDT 2019 | sssamw
Can you please tell us which components cracked? Component type, size, pitch, pin Qty, etc. The solder cracked in thermal cycling is very complicated and difficult to solve.
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