Electronics Forum | Thu Aug 15 09:36:48 EDT 2019 | davef
It could be delamination of the layered material of the MLCC caused by thermal shock or a component fabrication defect. For more on MLCC cracks: https://www.avx.com/docs/techinfo/CeramicCapacitors/cracks.pdf
Electronics Forum | Mon Jun 24 22:15:56 EDT 2019 | sssamw
Can you please tell us which components cracked? Component type, size, pitch, pin Qty, etc. The solder cracked in thermal cycling is very complicated and difficult to solve.
Electronics Forum | Mon Jun 30 10:52:36 EDT 2003 | Bob
Suggest you ask vendor for a failure analysis. Ceramic chips have specific signatures for mechanical or thermal shock cracking. The vast majority of failures are due to mechanical flex. Depanelization and secondary operations such as hand insertion
Electronics Forum | Thu Aug 15 16:45:09 EDT 2019 | stephendo
I just found this. https://www.avx.com/docs/techinfo/CeramicCapacitors/cracks.pdf It is extremely dated but still interesting. From the conclusion; " but both thermal shock and overstress cracks propagate at angles near 45°. Defective components h
Electronics Forum | Tue May 17 08:00:26 EDT 2005 | Bob R.
We went through this with one PBGA supplier recently and they were able to get the problem under control by fixing some of their molding processes that were inducing residual stresses. You can really see it in a thermal moire where you measure warpa
Electronics Forum | Thu Aug 24 13:51:24 EDT 2000 | Dr. Ning-Cheng Lee
Low temperature aggravates the mismatch in thermal expansion between solder and parts and between components and boards, therefore can induce earlier failure. The low temperature screening test should not be as effective when used on soft solders su
Electronics Forum | Thu Jul 25 22:03:50 EDT 2002 | davef
I need help understanding your problem. * What�s the difference between �e-test failure� and �total failure�? * Why do you think that an ESD induced failure would only be a �total failure�? * What if this is caused by a cracked solder connection? Yo
Electronics Forum | Thu Sep 03 11:45:34 EDT 1998 | Dave F
| I am in need of possible causes and solutions to capacitors that are failing in the field. | Are there issues in our process that need to be | checked? | Some people said the problems are due to improper | storage. Others say it is thermal stre
Electronics Forum | Mon Nov 27 08:05:50 EST 2006 | davef
There is no standard for a strain gage measurement of allowable deflection of a board or a fixture. It's possible that your fixture is causing the BGA cracking that you see. What protion of the BGA is cracking? If it is the solder connection, sear
Electronics Forum | Tue Feb 28 16:09:27 EST 2006 | outgasser
Does anyone have any insight as to the cause of cracked chip capacitors during SMT? Z-stop? Thermal shock? Any help is appreciated.
