Electronics Forum | Wed Aug 24 16:30:10 EDT 2011 | hussman
Low and behold, the answer has been found. I guess 2512 parts are not used inthe automotive wolrd due to the fact that they crack during thermal cycling!
Electronics Forum | Mon Nov 12 10:57:36 EST 2001 | emmanuel
We are to use a PBGA 272 and a PBGA 388. Between 500 and 750 thermal shocks (-45�C/+125�C), we have noticed that some cracks appear in the solder joints. According to our component specialists, these cracks are due to the whole design (pcb, component
Electronics Forum | Wed Dec 24 11:23:22 EST 2008 | childs
I can't seem to locate any information/concerns about moisture entrapment in IC packages on the promary side in a double sided SMT assembly using water soluable solder paste when soldering the second side. A typical process would assemble/reflow/cle
Electronics Forum | Wed Sep 07 10:34:52 EDT 2005 | PWH
Have experienced this on a few different cap. parts. Agree with other postings. Following are solutions to problems we have had: 1) Cracked cap too close to board edge per IPC spec. Designer replaced part with 3 caps in series to eleviate stress
Electronics Forum | Tue Jun 19 11:57:35 EDT 2001 | Gil Zweig
As you probably know, x-ray inspection has problems positivly identifying cracks or delamination. This task is more suited to scanning laser acoustical microscopy but the cost is very high. It has been our experience that cracks are associated with t
Electronics Forum | Tue May 26 18:17:22 EDT 1998 | Jerry
Our experience has been that mechanical crack occur vertically through the chip. In other words perpendicular to the board surface. You can sometimes tell through close inspection that the crack may have propogated from a point that the nozzle may
Electronics Forum | Mon Aug 11 09:59:40 EDT 2008 | John S.
Guys, We're seeing what looks like an issue where through hole solder joints from our ive solder process are cracking during the cooling phase of the soldering process. This was detected during thermal shock testing, and we have tracked it back to a
Electronics Forum | Thu Sep 03 13:49:30 EDT 1998 | Earl Moon
| I am in need of possible causes and solutions to capacitors that are failing in the field. | Are there issues in our process that need to be | checked? | Some people said the problems are due to improper | storage. Others say it is thermal stre
Electronics Forum | Wed Sep 09 01:28:33 EDT 1998 | John Godfrey
| | I am in need of possible causes and solutions to capacitors that are failing in the field. | | Are there issues in our process that need to be | | checked? | | Some people said the problems are due to improper | | storage. Others say it is th
Electronics Forum | Thu Jun 06 12:54:23 EDT 2013 | emeto
I think that you will be fine. You don't want to crack the part during it's stay on a high temperature in the reflow oven(thermal shock...thermal stress...). Once you mount the part on the board it will collect moisture again, but it is already proce
