Full Site - : thermally induced cracks (Page 9 of 43)

DoD/EPA/DOE SERDP WP-2213: Novel Whisker Mitigating Composite Conformal Coat Assessment

Technical Library | 2023-02-13 19:14:03.0

Technology Focus: Develop and evaluate nanoparticle filled conformal coatings designed to provide long term whisker penetration resistance and coverage on tin rich metal surfaces prone to whisker growth in commercial lead-free electronics used in modern DoD systems. Research Objectives: Identify the fundamental mechanisms by which conformal coatings provide long-term tin whisker penetration resistance and inhibit nucleation/growth. Correlate mechanical properties and coverage thickness to whisker penetration resistance. Project Progress and Results: Functionalized nanosilica and non-functional nanoalumina enhanced polyurethane conformal coatings have shown improved spray coating coverage characteristics and crack resistance during thermal cycling fatigue testing. Lead-free assembly whisker mitigation validation testing is in process. Technology Transition: Current project partners provide coating materials to industry. SERDP test data will be considered during updates to the DoD adopted IPC standards for coating materials and coverage.

BAE SYSTEMS

YINCAE's DA158N Die Attach Materials withstanding -273°C

Industry News | 2022-03-30 14:59:52.0

YINCAE is excited to announce that we have developed DA158N die attach materials which is thermal conductive and electrical insulating adhesives. It can be fast cured at low temperature. The development of DA 158N is preparing the materials for people to live in the Mars.

YINCAE Advanced Materials, LLC.

Christopher Associates Debuts Koki SB6N58-A730 Low-Temperature Lead-Free Solder Paste

Industry News | 2010-12-07 15:07:35.0

Christopher Associates announced today the introduction of Koki’s SB6N58-A730 Low Temperature Lead-Free Solder Paste. SB6N58-A730 paste has a melting point of 201-210°C. The paste also demonstrates extremely high thermal shock durability.

Christopher Associates Inc.

Eureka SDC-2001 Fast Super Dryer Ultra Low Humidity Dry Cabinet

Eureka SDC-2001 Fast Super Dryer Ultra Low Humidity Dry Cabinet

New Equipment | Board Handling - Storage

Eureka SDC-2001 Fast Super Dryer Ultra Low Humidity Dry Cabinet Specs: http://eurekadrytech.com/fast-super-dryer/sdc-2001 Model: Eureka SDC-2001 Fast Super Dryer Capacity: 1314 Liters Humidity Range: LESS THAN 10% Recovery Time: Recovers to ≤ 10% R

SMT Dry Cabinets by Eureka Dry Tech

Eureka SDC-1001 Fast Super Dryer Ultra Low Humidity Dry Cabinet

Eureka SDC-1001 Fast Super Dryer Ultra Low Humidity Dry Cabinet

New Equipment | Board Handling - Storage

SDC-1001 Fast Super Dryer Ultra Low Humidity Dry Cabinet Specs: Model: SDC-1001 Fast Super Dryer Capacity: 657 Liters Humidity Range: LESS THAN 10% Recovery Time: Recovers to ≤ 10% RH within 30 minutes after accessing door for 30 seconds or less. Ex

SMT Dry Cabinets by Eureka Dry Tech

Eureka SDC-101 Fast Super Dryer Ultra Low Humidity Dry Cabinet

Eureka SDC-101 Fast Super Dryer Ultra Low Humidity Dry Cabinet

New Equipment | Board Handling - Storage

Eureka SDC-101 Fast Super Dryer Ultra Low Humidity Dry Cabinet Specs: http://eurekadrytech.com/fast-super-dryer/sdc-101 Anti-static Glass, Anti-static Paint on Body and Shelves, ​Anti-static Stands, 1 M ω Ground Wire Model: SDC-101 Fast Super Drye

SMT Dry Cabinets by Eureka Dry Tech

Kyzen’s Dr. Bixenman to Hold IPC Webinar on Cleaning Highly Dense Circuit Assemblies

Industry News | 2011-06-16 15:01:31.0

Kyzen announces that Dr. Mike Bixenman will host an upcoming IPC Webinar titled “Cleaning Highly Dense Circuit Assemblies and Advanced Packages” on Tuesday, July 19, 2011 from 10-11 a.m. CST.

KYZEN Corporation

Kyzen's Dr. Bixenman Hosts Informative IPC Webinar on Cleaning Highly Dense Circuit Assemblies

Industry News | 2011-07-26 21:41:43.0

Kyzen announces that Dr. Mike Bixenman hosted an informative IPC Webinar titled “Cleaning Highly Dense Circuit Assemblies and Advanced Packages” on Tuesday, July 19, 2011.

KYZEN Corporation

Engineered Conductive Materials Launches Fast Curing High Tg Conductive Adhesive CA-100 for Ribbon Stringing CIGS Solar Modules

Industry News | 2012-08-10 07:00:10.0

Engineered Conductive Materials introduces its new fast curing Conductive Adhesive CA-100 for stringing and bussing next-generation CIGS solar modules.

Engineered Materials Systems, Inc.

Engineered Conductive Materials Introduces Low-Cost, Flexible Conductive Adhesive CA-141

Industry News | 2012-12-04 15:55:26.0

Engineered Conductive Materialsintroduces the fast curing CA-141 Conductive Adhesive for stringing and bussing next-generation CIGS solar modules.

Engineered Conductive Materials, LLC


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