Industry Directory: thickness after (4)

Citrus Technology

Industry Directory | Consultant / Service Provider / Manufacturer

Taiwan's leading design and manufacturing agency dealing with PCB and IC. Tech: Up to 40 layers, 2 Mill trace width .3" thickness. Global clientele, 11 years engineering, American/British staff.

Innovative Sensor Technology, USA Division

Industry Directory | Manufacturer

Innovative Sensor Technology is a manufacturer of thin-film platinum and nickel RTD temperature sensors, capacitive humidity sensors, mass flow sensors, conductivity and biosensors.

New SMT Equipment: thickness after (18)

S300 - Multiple Blade PLC Controlled PCB Depaneling Saw

S300 - Multiple Blade PLC Controlled PCB Depaneling Saw

New Equipment | Depaneling

Cut panels without scoreline and with overhanging components. The S300 diamond blade depaneling saw is ideal for use in singulating assembled PCBs. Singulate panels up to 12" wide. Microprocessor controlled STI safety interlock Long Lasting Di

FKN Systek

ETA SMT Stencil Printers

ETA SMT Stencil Printers

New Equipment | Printing

Semi-Automatic SMT Stencil Printers - P300, P350, P400. Using precision guide rail and the import motor to drive the blade seat conversion, printing, and high accuracy. Printing scraper can rotate 45 degrees fixed up, easy printing stencil a

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Electronics Forum: thickness after (523)

measument of paste thickness after Screen Printing

Electronics Forum | Sat Sep 04 11:58:44 EDT 2004 | Dhanashekar

Can anyone suggest me if it is necessary to measure the paste thickness after contact Screen printing.Is it a very vital parameter for the production process?

measument of paste thickness after Screen Printing

Electronics Forum | Sat Sep 04 18:52:51 EDT 2004 | iqbalb

Yes it is vital for process control.

Used SMT Equipment: thickness after (21)

Juki KE - 2060 l JUKI chip mounter

Juki KE - 2060 l JUKI chip mounter

Used SMT Equipment | SMT Equipment

Product name: KE - 2060 l JUKI chip mounter Product number: KE - 2060 l JUKI2060 chip mounter parameters: Mounting head: 3 Material stand: 80 Mount speed: 0.25 SEC/CHIP (3 head at the same time put in the attached SMT) Mounting speed:+ / - 0.

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Juki KE - 2010 l JUKI chip mounter

Juki KE - 2010 l JUKI chip mounter

Used SMT Equipment | SMT Equipment

Product name: KE - 2010 l JUKI chip mounter Product number: KE - 2010 l Products in detail Substrate size: Min: 50 mmx30mm Max: 330 mmx250mm Substrate thickness: Min: 0.4 mm Max: 4 mm Element size: 0402 ~ 20 mm square element or 26.5 X11mm Mo

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Industry News: thickness after (101)

MIRTEC to Display the 'World's Most Technologically Advanced' 3D AOI System at Productronica 2023

Industry News | 2023-10-16 12:50:01.0

MIRTEC announces the release of their All-New ART Hybrid 3D AOI System at Productronica 2023. The World's leading trade fair for the electronics manufacturing industry will take place Nov. 14-17, 2023, at the Trade Fair Center Messe München, Germany. All are welcome to MIRTEC's Booth #461 in Hall A2 for a detailed demonstration of what will undoubtedly be recognized as the World's Most Technologically Advanced 3D AOI System!

MIRTEC Corp

IPC Releases Revision A to IPC-2222 Design Standard

Industry News | 2010-12-17 01:47:04.0

IPC has released the A revision of IPC-2222, Sectional Design Standard for Rigid Organic Printed Boards. Helping developers avoid common missteps that reduce board manufacturability, IPC-2222 has been expanded to include more information on board materials, such as relative costs, tolerances of board thickness, unsupported holes, and hole aspect ratios.

Association Connecting Electronics Industries (IPC)

Parts & Supplies: thickness after (6)

ASC International 3D SPI-7500 Vision CE

ASC International 3D SPI-7500 Vision CE

Parts & Supplies | SPI / Solder Paste Inspection

Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK

KingFei SMT Tech

Mirae MPM FOIL,BOARD CLAMP,24 DEG,3.5MM LEG,.004 THICK,EA 1016013-04

Mirae MPM FOIL,BOARD CLAMP,24 DEG,3.5MM LEG,.004 THICK,EA 1016013-04

Parts & Supplies | Assembly Accessories

We can bring you the following benefits. 1. Save costs 2. MOQ:1 pc 3. You can find the SMT parts you want 4. Fast delivery-- receive the goods in about 7 days 5. Sincere one-to-one professional service 6. Quick response after-sales service Ple

Ruihua Electronic Co.,Ltd

Technical Library: thickness after (6)

Conformal Coating Thickness Measurement

Technical Library | 2013-10-13 10:54:13.0

The measurement of the conformal coating thickness on a printed circuit board (PCB) to ensure internal and international standards are met is now a critical factor in conformal coating process control. There are several methods for measurement of conformal coating thickness and they fall into two categories. These categories are wet film measurements applied during coating application and dry film measurements made after the coating is dried enough not to damage the coating.

SCH Technologies

Impact of Assembly Cycles on Copper Wrap Plating

Technical Library | 2020-07-22 19:39:05.0

The PWB industry needs to complete reliability testing in order to define the minimum copper wrap plating thickness requirement for confirming the reliability of PTH structures. Predicting reliability must ensure that the failure mechanism is demonstrated as a wear-out failure mode because a plating wrap failure is unpredictable. The purpose of this study was to quantify the effects of various copper wrap plating thicknesses through IST testing followed by micro sectioning to determine the failure mechanism and identify the minimum copper wrap thickness required for a reliable PWB. Minimum copper wrap plating thickness has become an even a bigger concern since designers started designing HDI products with buried vias, microvias and through filled vias all in one design. PWBs go through multiple plating cycles requiring planarization after each plating cycle to keep the surface copper to a manageable thickness for etching. The companies started a project to study the relationship between Copper wrap plating thickness and via reliability. The project had two phases. This paper will present findings from both Phase 1 and Phase 2.

Firan Technology Group

Videos: thickness after (222)

PCB unloader

PCB unloader

Videos

PCB magazine unloader/Multi magazine unloader how to receive the PCB after soldering, more detail check :https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_loader/91.html Multi Magazine PCB unloader is used at the end of the SMT line for unlo

ASCEN Technology

manual pcb separator

manual pcb separator

Videos

Manual V Cut PCB Depanelizer PCB Board Cutter It is widely used in modern rigid PCB industry. Manual V Cut PCB Depanelizer Machine Features: 1. Simple operation, speed is fast, to ensure that components of substrate are not injured by the move

Winsmart Electronic Co.,Ltd

Career Center - Jobs: thickness after (1)

Surface Grinder/Lapper Operator

Career Center | Chesterland, Ohio USA | Production

Surface Grinder/Lapper Operator Position Overview We currently have an excellent career opportunity for a Surface Grinder/Lapper Operator to join our Ceramics team at our Channel Products, Inc. facility in Chesterland, OH. This position is respons

CHANNEL PRODUCTS

Career Center - Resumes: thickness after (2)

NPI Engineer

Career Center | Theni, Tamilnadu India | Engineering

NPI Engineer: • Playing a role as NPI leader of the Telecom, Aerospace & Server Products to introduce and run to qualify the engineering build from customer. • Conducting Weekly NPI meeting with the CFT team to review the progress of the NPI schedu

3+ years of experience in the PCB CAM engineering

Career Center | Erode, Tamilnadu India | Engineering

Professional Summary 3+ years of experience in the PCB CAM engineering Exposure to FRONTLINE GENESIS 2000 Having exposure in UCAM Exposure to Create, Array & Panelize it for manufacturability Experienced in Creating impedance cou

Express Newsletter: thickness after (332)

Influence of Pd Thickness on Micro Void Formation of Solder Joints in ENEPIG Surface Finish

Influence of Pd Thickness on Micro Void Formation of Solder Joints in ENEPIG Surface Finish SMTnet Express December 13, 2012, Subscribers: 26067, Members: Companies: 9068, Users: 34058 Influence of Pd Thickness on Micro Void Formation of Solder

Partner Websites: thickness after (735)

XP142 XP143 XP243 1mm Thickness Fuji XP SMT Label Feeder

| https://www.feedersupplier.com/sale-13118549-xp142-xp143-xp243-1mm-thickness-fuji-xp-smt-label-feeder.html

XP142 XP143 XP243 1mm Thickness Fuji XP SMT Label Feeder Leave a Message We will call you back soon! Your message must be between 20-3,000 characters

Dual magazine PCB unloader connect AOI tester to separate the NG PCB board and OK PCB board after so

ASCEN Technology | https://www.ascen.ltd/Blog/machines/229.html

Dual magazine PCB unloader connect AOI tester to separate the NG PCB board and OK PCB board after soldering-PCB magazine loader,PCB turn conveyor,pcb conformal coating machine,PCB router,PCB

ASCEN Technology


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