3 thombstone results

Electronics Forum: thombstone (1)

TOMBSTONE DEFECTS

Electronics Forum | Fri Mar 14 04:42:24 EST 2003 | emeto

Hi, About Thombstone defects: 1.Placement accuracy-main reason 2.Soldering-should be right on pads.The print should have regular shape.The quontity of the solder on both pads on one component have to be equal. 3.Reflow: the profile have to be made v

Technical Library: thombstone (1)

Pin in Paste Stencil Design for Notebook Mainboard

Technical Library | 2008-03-18 12:36:31.0

This paper examines the construction of a notebook mainboard with more than 2000 components and no wave soldering required. The board contains standard SMD, chipset BGAs, connectors, through hole components and odd forms placed using full automation and soldered after two reflow cycles under critical process parameters. However, state of the art technology does not help if the process parameters are not set carefully. Can all complex BGAs, THTs and even screws be soldered on a single stencil? What will help us overcome bridging, insufficient solder and thombstoning issues? This paper will demonstrate the placement of all odd shape components using pin-in-paste stencil design and full completion of the motherboard after two reflow cycles.

Vestel Electronic