Industry News | 2019-04-23 08:08:27.0
Saki Corporation announces the release of its new 2Di-LU1 inline bottom-side automated optical inspection (AOI) system at NEPCON China, Shanghai, China, and SMTconnect, Nuremberg, Germany. Saki's 2D line-scan technology is ultra-fast, capturing the image of an entire 460x500mm printed circuit board assembly (PCBA) and carriers of 610x610mm in one pass, in real time, storing the image into memory, and creating inspection data for the entire board.
Industry News | 2021-06-18 13:02:59.0
New equipment for automated insertion of through-hole components increases Z-AXIS' capacity for mixed-technology PCB assembly, supports growing demand for USA contract manufacturing
Industry News | 2018-10-17 20:13:20.0
SHENMAO America, Inc. is pleased to announce that it was awarded a 2018 Global Technology Award in the category of Flux for its SM-862 Liquid Flux. The award was presented to the company during a Tuesday, Oct. 16, 2018 ceremony that took place during SMTA International.
Industry News | 2018-11-16 16:38:33.0
SHENMAO America is pleased to announce that it was awarded a 2018 Mexico Technology Award in the category of Flux for its SM-862 Liquid Flux. The award was presented to the company during a Wednesday, Nov. 14, 2018 ceremony that took place during the SMTA Guadalajara Expo & Tech Forum.
Industry News | 2019-01-30 08:42:31.0
SHENMAO America, Inc. is pleased to announce that it was awarded a 2019 NPI Award in the category of Flux for its SM-862 Liquid Flux. The award was presented to the company during a Tuesday, Jan. 29, 2019 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.
Industry News | 2017-02-15 13:18:55.0
Juki Automation Systems today announced that the companies were awarded a joint 2017 NPI Award. The award was presented to the companies in the Component Storage category for the new ISM UltraFlex 3600 during a Tuesday, Feb. 14, 2017 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.
Industry News | 2021-09-24 13:31:07.0
Investments over the past 18 months support continuing technology advancements and business growth at the electronics design and contract manufacturing center near Rochester, NY
Technical Library | 2020-05-07 03:46:27.0
The selective soldering process has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty, however some types of challenging components require additional attention to ensure optimum quality control is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures and/or pallets often places an additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors,can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues due to their beryllium copper termination pins.
Industry News | 2018-12-08 03:27:35.0
Printed Circuit Board (PCB) for Surface Mount Technology (SMT)
Industry News | 2014-03-18 10:29:34.0
Horizon Salesannounces that it has recorded more than $1.7 million in orders for Juki in a two-week period ending March 13, 2014.
