Full Site - : through hole diameter for wave soldering (Page 14 of 120)

ECOSELECT1 - The Perfect Start-up Solution for Efficient Selective Soldering

Industry News | 2011-12-01 14:01:34.0

Ersa has expanded its product range by the ECOSELECT 1: a selective soldering machine requiring less than 3 m² of space - thus fitting optimally into cell production environments.

kurtz ersa Corporation

Hanwha Introduces Quick, Reliable Through-Hole Component Insertion System for Automated PCB Assembly Processes

Industry News | 2018-02-12 10:20:20.0

Hanwha’s model SM485P SMART Hybrid Mounter is designed for a wide range of applications including the processing of radial and axial through-hole components requiring controlled force insertion prior to reflow, wave or selective soldering. Innovative feeder technology features lead forming and cutting for efficient delivery of prepared components to the Mounter for quick and reliable processing.

Hanwha Techwin CO., LTD.

Seika Adds Video Demonstrations for Seitec STS-2533SJ Selective Soldering System on Seika TV

Industry News | 2013-07-22 17:06:14.0

Seika Machinery, Inc. announces that it has added four new video demonstrations of the Seitec STS-2533SJ Selective Soldering System with Built-in Spray Fluxer.

Seika Machinery, Inc.

Sono-Tek Corporation to Show the New QR Impact Jet for the Spray Fluxer at APEX

Industry News | 2015-01-21 20:14:04.0

Sono-Tek Corporation (OTC BB: SOTK) will highlight the newest improvement to the SonoFlux ultrasonic spray fluxer design, the QR Impact Jet in Booth #3521 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. The Impact atomizing assembly is used in both the Sono-Flux Servo and Sono-Flux EZ system and incorporates an air deflector that drives the flux droplets to the PCB for maximum top side fill and unsurpassed through-hole penetration.

SONO-TEK CORPORATION

How to Use the Right Flux for the Selective Soldering Application

Technical Library | 2017-05-17 22:33:43.0

The selective soldering application requires a combination of performance attributes that traditional liquid fluxes designed for wave soldering applications cannot fulfill. First, the flux deposition on the board needs to be carefully controlled. Proper fine tuning of the flux physicochemical characteristics combined with a process optimization are mandatory to strike the right balance between solderability and reliability. However, localization of the flux residue through the drop jet process is not enough to guarantee the expected performance level. The flux needs to be designed to minimize the impact of unavoidable spreading and splashing events.From this perspective a fundamental understanding of the relationships between formulation and reliability is critical. In this application, thermal history of the flux residues (from room temperature to solder liquidus) is a key performance driver. Finally, it is necessary to conduct statistically designed experiments on industrial selective soldering machines in order to map the relationships between flux characteristics and selective process friendliness.

Kester

Juki and Intertec Win NPI Award for New CUBE.460 Selective Soldering System

Industry News | 2014-03-26 08:58:27.0

Juki Automation Systems (JAS), Inc.are pleased to announce that they have been awarded a 2014 NPI Award in the category of Soldering – Selective for the CUBE.460 Selective Soldering System.

Juki Automation Systems

Meet with the One-Stop Source for Engineering, Training and Distribution Services at SMTA International

Industry News | 2013-09-12 14:29:04.0

STI Electronics, Inc. announces that it will exhibit in Booth #301 at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas.

STI Electronics

Saki Corporation Introduces Ultra-fast, Inline, 2D Bottom-side Automated Optical Inspection for PCBs

Industry News | 2019-04-23 08:08:27.0

Saki Corporation announces the release of its new 2Di-LU1 inline bottom-side automated optical inspection (AOI) system at NEPCON China, Shanghai, China, and SMTconnect, Nuremberg, Germany. Saki's 2D line-scan technology is ultra-fast, capturing the image of an entire 460x500mm printed circuit board assembly (PCBA) and carriers of 610x610mm in one pass, in real time, storing the image into memory, and creating inspection data for the entire board.

SAKI America

Z-AXIS Adds Equipment for Mixed-Technology PCB Assembly in the USA

Industry News | 2021-06-18 13:02:59.0

New equipment for automated insertion of through-hole components increases Z-AXIS' capacity for mixed-technology PCB assembly, supports growing demand for USA contract manufacturing

Z-AXIS, Inc.

Juki Automation Systems and Storage Solutions Receive the 2017 NPI Award for Component Storage

Industry News | 2017-02-15 13:18:55.0

Juki Automation Systems today announced that the companies were awarded a joint 2017 NPI Award. The award was presented to the companies in the Component Storage category for the new ISM UltraFlex 3600 during a Tuesday, Feb. 14, 2017 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.

Juki Automation Systems


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