Industry News | 2019-08-27 23:44:30.0
Seica will be exhibiting at the Rosemont, IL Conference and Convention Center on September 24-25 in booth 415. On exhibition will be Seica's new desktop Dragonfly AOI inspection system, which utilizes leading-edge LED technology to perform conformal coat and through-hole-technology inspection, including presence checks of pins and solder, effectively combining two distinct inspection processes in a single machine.
Industry News | 2009-01-23 02:17:04.0
OSAKA, JAPAN � January 2009 � Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the worldwide market, introduces NS-F850 rosin-based flux for lead-free wave soldering.
Industry News | 2023-01-16 07:16:27.0
Customers looking for leading-edge test solutions can come to Seica's booth 2511 and view the newest line of Flying Probe test on the market in the form of the PILOT VX platform, bed of nails ICT solutions, the Compact LR, and Mini200 and the latest conformal coat inspection systems, the Dragonfly.
Technical Library | 2022-08-08 15:06:06.0
Selective soldering has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty however some types of challenging components require additional attention to ensure that optimum quality is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures, or solder pallets, often places additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors, can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues because of their beryllium copper base metal pins. Key Terms: Selective soldering, drop-jet fluxing, sustained preheating, flux migration, adjacent clearance, lead-to-hole aspect ratio, lead projection, thermal reliefs, gold embrittlement, solderability testing.
Industry News | 2013-01-17 11:06:48.0
Juki Automation Systems, Inc. today announced its product lineup to be exhibited in Booth #513 at the upcoming IPC APEX EXPO
Industry News | 2016-08-15 11:14:37.0
DDM Novastar, a U.S. manufacturer of SMT and PCB assembly equipment, has set the schedule for its popular Paste-Place-Reflow workshop, on September 14 and 15, 2015.
Industry News | 2018-10-17 19:34:14.0
Naprotek, Inc.today announced that it was awarded a 2018 Global Technology Award in the category of Contract Services
Industry News | 2018-10-18 09:16:42.0
New Technology for Void-free Reflow Soldering
Technical Library | 2015-02-27 17:06:01.0
The drive towards fine pitch technology also affects the soldering processes. Selective soldering is a reliable soldering process for THT (through hole) connectors and offers a wide process window for designers. THT connectors can be soldered on the top and bottom side of boards, board in board, PCBs to metal shields or housing out of plastic or aluminum are today's state of the art. The materials that are used to make the solder connections require higher temperatures. Due to the introduction of lead-free alloys, the boards need more heat to get the barrels filled with solder. This not only affects the properties of the flux and components, but the operation temperatures of solder machines become higher (...)First the impact of temperature will be discussed for the separate process steps and for machine tooling. In the experimental part measurements are done to verify the accuracy that can be achieved using today's selective soldering machines. Dedicated tooling is designed to achieve special requirements with respect to component position accuracy.
