Used SMT Equipment | THT Equipment
Very nice Q Corporation Lead Trimmer Cutter For Sale! See attached pictures and information below. Equipment Description •Q Corporation 2000 Series Q2G lead trimmer •Brushless DC drive for low maintenance with dynamic braking •Variable
Technical Library | 2019-05-23 10:30:22.0
Increasing I/O numbers, device complexity, and product miniaturization requires high precision bonding tools, and sophisticated equipment. Careful consideration should be given to wedge geometry while selecting the tool for a fine pitch wire bonding application. Wire bonding is a process that creates an electrical connection between a die and a substrate or lead typically using gold or aluminum wire. Wedge bonding is a specific type of wire bonding that uses a wedge shaped tool to create the welds. The design of the wedge tool has changed very little over the past decade. The wire is fed at an angle through the back of the wedge. This angle is typically 30 to 60 degrees and is application dependent. Some applications require a higher feed angle due to package clearance issues. Some deep access applications require a 90 degree feed angle. In this configuration, the wire is fed through a hole in the shank of the wedge tool. Wire feed is shown in Figure 1.
Events Calendar | Thu Aug 10 00:00:00 EDT 2023 - Thu Aug 10 00:00:00 EDT 2023 | Melbourne, Florida USA
Space Coast: Microscope Setups, Getting the Best Results From Your Equipment, a Panel Discussion
New Equipment | Selective Soldering
Enhanced, flexible, in-line, modular selective soldering system Designed as a modular system, the Synchrodex Pro range of in-line equipment offers the ultimate in flexibility with the ability to upgrade to high-speed throughput when multiple modules
New Equipment | Education/Training
Learn to identify (with the use of aids, visuals or actual components) packaging types of the most commonly used through-hole and surface mount components, interconnections and hardware used in electronic assembly. This course also covers color code
Used SMT Equipment | AOI / Automated Optical Inspection
Hello and thank you for your interest in our MVP Machine Vision Products AOI Machines For Sale. We have a total of (4) MVP Automated Optical Inspection Machines and (2) Inspection Repair Stations.. They were taken off line due to company closer. All
Industry News | 2021-08-13 12:11:05.0
The Wafer-Level Packaging Symposium is scheduled for February 15-17, 2022 in San Jose, CA, USA. The theme of the event is "Advanced Packaging: The Dawn of a New Era." The development of Advanced Package Technology is undergoing a massive change because Electrical System Architects are directly driving package performance requirements.
Industry News | 2019-02-19 19:38:20.0
PCB Technology Trends 2018, a new global study published by IPC is now available. The survey-based study shows how printed circuit board (PCB) manufacturers are meeting today’s technology demands and looks at the changes expected by 2023 that will affect the whole industry.
Industry News | 2013-11-26 14:46:08.0
The 2013 International Wafer-Level Packaging Conference (IWLPC), organized by SMTA and Chip Scale Review magazine, celebrated its 10th consecutive annual event on November 5-7, 2013 with a very successful conference and exhibition. Technical presentations covered a large range of applications, challenges, and solutions. This 10th anniversary event with over six hundred total participants had thirty-nine presentations in three parallel tracks over the two days.
Industry News | 2012-09-10 12:48:23.0
To help companies gain the most out of HDI technology, Raytheon is sponsoring the “IPC HDI Conference: Advancements in Materials, Processes and Applications,” October 24–25 in Los Angeles, Calif.
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