Industry News | 2003-02-25 08:18:29.0
Teradyne can now provide deep micro-via technology for customers of high-performance printed circuits.
Industry News | 2003-05-08 07:22:00.0
Over 400 contract manufacturers present every aspect of outsource capability.
Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
Industry News | 2003-02-25 09:10:01.0
The CSPEMI400 complements California Micro Devices' broad portfolio of CSP (chip scale package) devices for stand-alone ESD protection and EMI filter arrays with ESD protection, making it the most extensive in the industry.
Industry News | 2003-05-30 08:09:11.0
A new compact package integrates a Hall-effect sensor IC with a back-biasing magnet to achieve high airgap performance and meet restrictive space requirement.
New Equipment | Rework & Repair Equipment
Orange Sticks with double beveled ends, 7" x 5/32" (SH-83) The Beau Tech orange sticks are made of high quality non-resin wood which will not contaminate solder and component leads. Natural wood is among the best material that does not gen
Industry News | 2003-04-18 08:31:57.0
Unichem to enhance its support and service for North American dry film photoresist and soldermask lamination equipment customers.
Industry News | 2003-02-27 08:22:44.0
Circatex is to open its first satellite office in mainland Europe in France.
Industry News | 2019-09-21 04:24:14.0
MIRTEC announce that their business within the European territories will be controlled by their German subsidiary, MIRTEC GmbH, which was previously managed by MIRTEC Europe situated in UK. The President of MIRTEC Europe David Bennett will be moving to a new role as Managing Director of Bentec Ltd. to concentrate on their two main European-controlled territories, namely UK & India.
Industry News | 2003-03-26 08:25:40.0
The QVE00033 transmissive switch's small size, surface mount package and performance make it ideal for noncontact switching applications in disk drives, card detectors, mise and trackballs.
