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Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force

Technical Library | 2023-01-17 17:27:13.0

Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)

Heller Industries Inc.

Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow

Technical Library | 2019-07-10 23:36:14.0

Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.

Heller Industries Inc.

Field Service Engineer

Career Center | Florham Park, New Jersey USA | Engineering

Field Service Engineer Job Description The basic function of this position: Installation, training, repair, and implementation of retrofits on the complete line of Heller reflow ovens. Candidate must be a US citizen. DUTIES AND RESPONSIBILITIES: S

Heller Industries Inc.

Heller Industries Mark 5 Wins 2012 VISION Award

Industry News | 2012-05-11 20:35:45.0

Heller Industries has been awarded a 2012 SMT VISION Award in the category of Soldering Reflow for its 1936 Mark 5 Reflow Oven. The award was presented on April 25, 2012 at the Nepcon China Exhibition.

Heller Industries Inc.

HELLER'S High UPH Vacuum Oven Wins the "17th Step-by-Step Excellence Awards"

Industry News | 2023-10-18 17:43:18.0

HELLER's High UPH Vacuum Reflow Oven clinched the coveted "Step-by-Step Excellence Awards" - Innovation Award owing to its industry-leading product strength and outstanding performance.

Heller Industries Inc.

Heller Industries Will Feature the MK7 Reflow Oven Featured at IPC APEX 2022 Booth #1920

Industry News | 2021-11-08 14:38:39.0

Heller Industries, a leading supplier of reflow soldering ovens for electronic manufacturing and pressure curing ovens for back-end semicondutor manufacturing, today announced they will be exhibiting their new MK7 reflow oven at the San Diego Conference Center January 25-27, 2022.

Heller Industries Inc.

Congressman Rodney Frelinghuysen Visits Heller Industries in New Jersey.

Industry News | 2014-09-06 19:18:17.0

Briefing Co-hosted by IPC as Part of Continuing Effort to Connect IPC Members with Policymakers.

Heller Industries Inc.

Henkel Names New Global Sales Director for Semiconductor Materials

Industry News | 2009-02-02 18:48:47.0

Henkel today announced the appointment of Mr. Luc Godefroid as the company's Global Sales Director for its Semiconductor Group. A key member of Henkel's electronics sales team since 2001, Godefroid's new role sees him building on his previous success and directing the global sales efforts of Henkel's worldwide team and expanded product portfolio.

Heller Industries Inc.

HELLER Convenes a Successful 2024 Sales Kickoff Meeting, Setting the Stage for a Strong Year Ahead

Industry News | 2024-02-26 16:22:08.0

HELLER, a leading provider of reflow soldering equipment, concluded its 2024 Sales Kickoff Meeting in Suwon, South Korea on a high note. The meeting brought together sales representatives from all branches and subsidiaries to discuss the company's unified goals and objectives for the year ahead, and to equip them with the tools and knowledge necessary to achieve success.

Heller Industries Inc.

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