According to the EPA, poor indoor air quality (IAQ) is among the top five environmental risks. Most people are aware that outdoor air pollution can damage their health, but most are unaware that indoor air pollution can also have significant health e
Industry Directory | Manufacturer
EKO Endüstri was established in 1999 in Kemalpaşa Organized Industrial Zone as a company, which shapes metal, open for innovation and customer oriented.
Technical Library | 2017-06-13 17:14:59.0
For tin-rich solder alloys, 200 C (392 F) is an extreme temperature. Intermetallic growth in tin-copper systems is known to occur and is believed to bear a direct relationship to failure mechanisms. This study of morphological changes with time at elevated temperatures was made to determine growth rates of tin-copper intermetallics. Preferred growth directions, rates of thickening, and notable changes in morphology were observed.Each of four tin-base alloys was flowed on copper and exposed to temperatures between 100 C and 200 C for time periods of up to 32 days. Metallographic sections were taken and the intermetallics were examined. Intermetallic layer thickening is characterized by several distinct stages. The initial growth of side plates is extremely rapid and exaggerated. This is followed by retrogression (spheroidization) of the elongated peaks and by general thick-
Industry News | 2014-08-04 18:29:18.0
IPC — Association Connecting Electronics Industries® has announced the release of Where in the World? A Regional Strategy Roadmap for Electronics Manufacturers.
Industry Directory | Manufacturer / Other
Schweitzer Engineering Laboratories designs and manufactures equipment for the protection, automation, metering and control of electric power systems
Industry News | 2007-08-27 19:09:00.0
offered by Surface Mount Technology Association (SMTA)
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Industry News | 2006-08-28 17:21:31.0
Independent Evaluation of Soldering Stations
Technical Library | 2022-09-12 14:07:47.0
Unique component handling issues can arise when an assembly factory uses highly-moisture sensitive surface mount devices (SMDs). This work describes how the distribution of moisture within the molded plastic body of a SMD is an important variable for survivability. JEDEC/IPC [1] moisture level rated packages classified as Levels 4-5a are shown to require additional handling constraints beyond the typical out-of-bag exposure time tracking. Nitrogen or desiccated cabinet containment is shown as a safe and effective means for long-term storage provided the effects of prior out-of-bag exposure conditions are taken into account. Moisture diffusion analyses coupled with experimental verification studies show that time in storage is as important a variable as floor-life exposure for highly-moisture sensitive devices. Improvements in floor-life survivability can be obtained by a handling procedure that includes cyclic storage in low humidity containment. SMDs that have exceeded their floor-life limits are analyzed for proper baking schedules. Optimized baking schedules can be adopted depending on a knowledge of the exposure conditions and the moisture sensitivity level of the device.
Events Calendar | Thu Apr 05 00:00:00 EDT 2018 - Thu Apr 05 00:00:00 EDT 2018 | ,
Understanding the EU REACH Regulation Changes to the Definition of an "Article"
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