Industry News | 2011-03-11 14:53:57.0
A new study conducted by IPC — Association Connecting Electronics Industries® predicts that reporting requirements for conflict minerals proposed by the U.S. Security and Exchange Commission (SEC) would cost the electronic interconnect industry an estimated $279 million in the first year of implementation for due diligence alone, compared to the government’s estimate of $16.5 million.
Industry News | 2012-06-29 17:09:10.0
Electronic product and manufacturing trends continue to challenge both users and providers of test and inspection technologies at all levels of the supply chain.
Events Calendar | Wed May 04 00:00:00 EDT 2022 - Wed May 04 00:00:00 EDT 2022 | ,
Virtual Course: Cost Modeling Your Assembly Line or Factory to Reduce Costs & Improve Profitability
Industry News | 2010-11-15 22:46:09.0
Research conducted by IPC indicates the top ten technology trends to watch in electronics manufacturing. Free White Paper Reveals Industry Views on Critical Technologies
Industry News | 2022-07-08 19:17:09.0
Absolute EMS, Inc. is pleased to announce that the Loyola Marymount University (LMU) EMBA students visited its facility in Santa Clara on Wednesday, June 10, 2022. The visit was part of the University's weeklong Business Excellence study on managing innovation in organizations.
Industry News | 2023-10-16 11:30:20.0
PCB Technology Trends 2023, IPC's biennial global study, is now available. The survey-based study shows how printed circuit board (PCB) manufacturers are meeting today's technology demands and looks at the changes expected by 2028 that will affect the whole industry. Based on data from 60 companies worldwide, the 48-page report presents data on PCB technology and OEMs' PCB requirements as of 2023, as well as OEMs' use of emerging technologies. Predictions from both industry segments indicate what these measurements are expected to be five years into the future.
Industry News | 2011-10-24 23:43:23.0
A Tulane University economic analysis, which drew heavily on an IPC survey of the electronics industry, assessed the costs of implementing the Dodd-Frank conflict minerals regulation to be $7.93 billion - more than one hundred times greater than the estimate prepared by the U.S. Securities and Exchange Commission (SEC) of $71.2 million.
Industry News | 2003-03-20 09:03:05.0
Organizing a Flip Chip and BGA Packaging Technologies Workshop as a part of the SMTA Boston 2003 Conference (June 9-11) at the Bayside Convention Center in Boston, Massachusetts.
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Events Calendar | Wed Mar 07 00:00:00 EST 2018 - Wed Mar 07 00:00:00 EST 2018 | ,
Solder Paste Qualification Testing - SMTA Webinar
