Industry News | 2023-10-16 11:30:20.0
PCB Technology Trends 2023, IPC's biennial global study, is now available. The survey-based study shows how printed circuit board (PCB) manufacturers are meeting today's technology demands and looks at the changes expected by 2028 that will affect the whole industry. Based on data from 60 companies worldwide, the 48-page report presents data on PCB technology and OEMs' PCB requirements as of 2023, as well as OEMs' use of emerging technologies. Predictions from both industry segments indicate what these measurements are expected to be five years into the future.
Industry News | 2011-10-24 23:43:23.0
A Tulane University economic analysis, which drew heavily on an IPC survey of the electronics industry, assessed the costs of implementing the Dodd-Frank conflict minerals regulation to be $7.93 billion - more than one hundred times greater than the estimate prepared by the U.S. Securities and Exchange Commission (SEC) of $71.2 million.
Industry News | 2003-03-20 09:03:05.0
Organizing a Flip Chip and BGA Packaging Technologies Workshop as a part of the SMTA Boston 2003 Conference (June 9-11) at the Bayside Convention Center in Boston, Massachusetts.
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Events Calendar | Wed Mar 07 00:00:00 EST 2018 - Wed Mar 07 00:00:00 EST 2018 | ,
Solder Paste Qualification Testing - SMTA Webinar
Industry News | 2012-05-09 13:57:33.0
SMTA China announced the Best and Excellent Paper and the Best and Excellent Presentation and Best Exhibit Awards at its annual awards presentation held in conjunction with SMTA China Annual Breakfast Reception and Recognition Ceremony,
Industry News | 2021-11-24 15:25:19.0
Stronger IC substrate and OSAT capabilities are needed to realize U.S. semiconductor goals
Industry News | 2011-08-10 20:24:10.0
Kicking off an intense, two-day focus on the latest technologies, processes and best practices in electronics manufacturing, Jim Springer, vice president of quality at Phoenix International, will deliver the free opening session at IPC Midwest Conference & Exhibition in Schaumburg, Ill. His presentation, “Clearly Understanding Field Failures Leads to Interesting New Knowledge (CUFFLINK) - A Case Study,” will take place on September 21 at 8:00 am.
Industry News | 2016-12-06 18:44:21.0
Printed circuit boards (PCBs) for military and aerospace applications remain the largest vertical market segment for PCB manufacturers in North America, representing about one-third of the market. And it is the only vertical market segment expected to grow in 2016 as a share of the North American market, according to IPC's 2016 Analysis and Forecast for the North American PCB Industry.
Industry News | 2009-07-30 21:44:14.0
Minneapolis, MN - The SMTA is pleased to announce three symposia to be featured at SMTA International: the Evolving Technologies Summit, Contract Manufacturing Symposium, and Lead-Free Soldering Technology Symposium.
