Electronics Forum | Mon Sep 25 15:32:21 EDT 2023 | joeljacobo
hello colleagues, Hoping that everyone is doing well, I am reaching out to you in the hope that your experience can help me. We have a wave solder with sac0307 alloy and the pot has turned a golden color, at first I thought it was common tin oxidat
Electronics Forum | Fri Nov 03 11:30:29 EDT 2017 | davef
regarding dwl comment, "For low volume hand assembly, deionized water or IPA should work fine." Deionized water: Deionized water is corrosive. It needs to be removed. Proof? Drop a copper coin into a covered jar of DI water and watch what happens ov
Electronics Forum | Fri Nov 02 14:46:18 EDT 2012 | ericrr
So how does this (lead free paste Sn42/Bi58) solder compare with the Sn-Ag-Cu (Tin-Silver-Copper) combination which does not flow as well (in the oven), needs higher oven temperature, (that can be adjusted by reducing the oven chain speed) and cost m
Electronics Forum | Wed May 15 08:33:43 EDT 2013 | emeto
SAC is a lead free alloy that comes from SnAgCu(tin, silver, copper). When you say SAC305 that means 3%Ag 0.5%Cu and the rest is Tin. About the LF I assume that it means Lead Free, but what metal contents it has I can only guess.
Electronics Forum | Thu Jul 20 16:04:22 EDT 2000 | Bob Willis
Tin/silver/copper is the alloy I have done most with and it would seem that it will be the alloy of choice if you look at the people doing the work. There are still some issues of fillet lifting which I have seen on PIHR soldering and the same in wav
Electronics Forum | Mon Sep 27 22:25:05 EDT 2004 | KEN
Minimal cost and low melting point??? Have you bought Indium or Bismuth based alloys lately? Tin/Silver, Tin silver coper-X you name it....there are trade-offs (cost / performance). Not all are exactly published or are suitable for all appliations
Electronics Forum | Thu Aug 07 10:02:10 EDT 2008 | eyalg
We are facing low quality due to soldering opens with coilcraft inductors 0402CS-2N7XGLW. The termination used is(suffix L =RoHS compliant silver-palladium-platinum-glass frit. Did anyone had this problem in the past? Can we do better using T = RoH
Electronics Forum | Wed Dec 11 06:47:33 EST 2019 | ameenullakhan
Dear Friends, Need your valuable feedback on how to identify the component is ok or not for manufacturing. Issue : We have parts which are more than 5 years old.And management want us to qualify this parts for production. We presently use below me
Electronics Forum | Mon Apr 12 22:49:09 EDT 2004 | Ken
I will assume the balls of the device are tin-silver or tin-silver-copper??? There is no reason why you can not run 63-37 solder paste on this device. You will form an intermetallic at the interface structure, however, you will NOT form the 2/3 col
Electronics Forum | Sat Nov 03 10:57:27 EDT 2012 | davef
EricR: Regarding "*** By the way, since we have used the Tin-Silver-Copper lead free solder there has been a strange liquid type chemical leek from the oven exhausted pipes." ... I don't know anything about your process, but the first thing I'd inve
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