Electronics Forum | Tue Aug 31 17:36:36 EDT 2004 | davef
NO-LEAD COMPONENTS WITH LEAD SOLDER ISSUE: We agree with Russ. We've dicussed this several times on SMTnet. For instance, look here http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=25394 LEAD COMPONENTS WITH NO-LEAD SOLDER ISSUE: We disa
Electronics Forum | Thu Feb 22 04:00:02 EST 2001 | Scott B
We are increasingly being asked to store components for longer and longer periods which we know through experience leads to reduction or total loss of solderability of the parts. 1) What is the industry accepted shelf life of tin/lead plated compone
Industry News | 2018-02-19 13:55:53.0
IPC — Association Connecting Electronics Industries® Pb-free Electronics Risk Management (PERM) Council has developed the first single document dedicated solely to assisting design engineering in the development of electronics that are completely lead-free (Pb-free) and meet the demanding requirements of aerospace, defense and high performance (ADHP) products and systems.
Industry News | 2018-10-09 18:31:30.0
Whether in production, or repair and rework, the cost of soldering iron tips can be easily overlooked, but with today’s requirement for higher temperatures in lead-free solder applications, the consumption of tips has dramatically increased. This fact, combined with changes in tip design to meet the higher thermal load requirements, has also resulted in escalating tip costs, making tip care a high priority.
New Upgrade — I.C.T SMT LED Flexible Pick and Place Machine M series In 2022, we have upgraded the equipment of the M series pick and place machine for SMT Production line. I.C.T M series pick and place machine is mainly used for the producti
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
BGA Package Component Reliability After Long-Term Storage BGA Package Component Reliability After Long-Term Storage In 2008, the white paper Component Reliability After Long Term Storage was published in support of shelf life extension
| https://pcbasupplies.com/thermaltronics-m7bvf010h-bevel-60deg-1-00mm-0-04-tin-area-face-only-power-plus/
: Thermaltronics Description Additional information Description Thermaltronics M7BVF010H Bevel 60deg 1.00mm (0.04″), Tin Area Face Only, Power Plus Thermaltronics M Series - Power Plus tips are designed with a larger copper mass and extra plating
| https://www.eptac.com/soldertips/dealing-with-the-problems-of-soldering-iron-tips-breaking-down/
. We are soldering lead free materials between 600 and 700 degrees F and increasing the contact dwell time by about 1 to 1.5 seconds. The new lead free alloys are high in tin content and the tin will dissolve the plating on the solder iron tip and eventually eat through the tip
