New Equipment | Assembly Services
TW-Multilayer PCB 0123 Price: Get Latest Price Minimum Order Quantity: 10 Unit/Units other Port: HK Packaging Details: blister and package Delivery Time: 1 week Payment Terms: L/C,D/P,T/T,Western Union Supply Ability: 5000000 Unit/Units per Y
New Equipment | Assembly Services
TW-Aluminum PCB 0201 Price: Get Latest Price Minimum Order Quantity: 10 Unit/Units other Port: HK Packaging Details: blister and package Delivery Time: 1 week Payment Terms: L/C,D/P,T/T,Western Union Supply Ability: 5000000 Unit/Units per Y
SIPAD Solid Solder Deposit (ssd) is a Siemens patented process that pre loads the pc board surface mount pads with solder in a solid form. Boards are printed, reflowed without components producing a predictable repeatable meniscus. SIPAD boards a
Industry News | 2011-09-14 11:38:51.0
Jasbir Bath, Consulting Engineer for Christopher Associates Inc./Koki Solder, will present “A Review of Issues and Next Steps in Moving From Sn3Ag0.5Cu to Low-Silver Solder Alloys” at the upcoming IPC Midwest Conference & Exhibition.
Industry News | 2012-01-26 22:34:41.0
Christopher Associates announces that Jasbir Bath, Consulting Engineer with Christopher Associates/Koki Solder, will present at the IPC APEX EXPO 2012. The presentation, “Low Temperature Tin-Bismuth and Tin-Bismuth-Silver Lead-free Solder Pastes for Electronics Manufacturing,” will take place during Session S16, titled “Lead-free Alloys,”.
Industry News | 2004-02-04 16:52:03.0
Prepare for the 2006 European Deadline
Industry News | 2022-01-24 18:01:46.0
Available component modification services utilizing Hentec/RPS Odyssey RHSD systems include BGA de-balling, gold mitigation, lead tinning and tin whisker mitigation.
Industry News | 2021-05-04 13:53:27.0
Odyssey 1750 provides high reliability BGA alloy exchange and component re-finishing capabilities.
Industry News | 2021-03-30 16:42:31.0
Odyssey component lead tinning machines provide high reliability BGA alloy exchange and component re-finishing capabilities.
Industry News | 2021-08-25 16:20:31.0
Two additional Hentec/RPS Odyssey 1325 RHSD machines will expand high reliability BGA alloy exchange and component re-finishing capabilities.
