Industry News | 2021-08-02 14:05:26.0
New Yorker Electronics supplies Cornell Dubilier CDE BLH Series DC Link Capacitors for Long Life, High Power Density and Low ESR Designed for Harsh Environments
Industry News | 2006-06-23 16:19:47.0
Group Addresses Assembly Process and Reliability Requirements for SnPb and Pb-free Modules
Industry News | 2020-01-06 16:02:00.0
Nihon Superior Co. Ltd. is pleased to announce plans to showcase its new TipSave N flux-cored solder wire in Booth #2043 at the 2020 IPC APEX EXPO, scheduled to take place Feb. 4-6, 2020 at the San Diego Convention Center in California. The company also will exhibit SN100CV P608 D5 solder paste.
Industry News | 2021-03-29 13:51:33.0
Designed for Harsh Environments, Cornell Dubilier's New ALH AC-Rated Filter Capacitors offer 50% Greater Life than Competitive Film Capacitors
Industry News | 2021-10-29 17:35:29.0
New Cornell Dubilier Electronics Capacitor Series is rated at 6,000 hours; new Patented Design Safely Expands Mounting Options
Industry News | 2022-01-03 07:24:21.0
Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its newly developed TempSave series during the 2022 IPC APEX Virtual EXPO, scheduled to take place Jan. 25-27, 2022 at the San Diego Convention Center, San Diego, CA. The company also will showcase its TipSave N alloy along with SN100CV P608 and LF-C2 P608 solder pastes.
Industry News | 2017-01-29 09:37:08.0
TopLine will exhibit its MSC Series of Micro-coil springs, a novel interconnect for CCGA (Ceramic Column Grid Array) IC packages for harsh environments. In tests using daisy chain test vehicles, Micro-coil springs absorbed extreme shock of up to 50,000g before failing. Commercial applications include aerospace, avionics, military, down-hole oilfield drilling and automotive electronics. Test results were initially presented at IEEE CPMT 2012.
Industry News | 2019-03-05 17:59:34.0
SHENMAO America, Inc. is pleased to announce that it will exhibit at electronica China, scheduled to take place March 20-22, 2019 at the Shanghai New International Expo Centre. The company will showcase its PQ10 series low temperature solder paste, new P250 series solder paste for automobile electronics, PW215 water soluble solder paste, SMF-WC53 water soluble ball-attach flux and solder sphere, and water-based wave soldering flux & water-based cleaner.
Electronics Forum | Thu Aug 29 17:45:54 EDT 2002 | nifhail
What are other testing/process step that we should do if we where to use the old date code QFPs other than solderability and baking ? What is the plating composition normally %? lead, % tin etc. I have my policy not to accept the more than 12 mont
Electronics Forum | Wed Aug 09 08:06:07 EDT 2006 | davef
See "IPC-4554 Specification for Immersion Tin Plating for Printed Circuit Boards" 3.2.1 Immersion Tin Thickness. The most common reason for solderability issues with the white tin surface coating during multiple thermal excursions is a thin white ti
