Full Site - : tin plated components shelf life (Page 7 of 11)

Re: CuOSP and IMM Silver versus HASL

Electronics Forum | Thu Aug 31 18:59:55 EDT 2000 | Brian W.

Our customers use OSP, HASL, immersion tin and immersion gold as board finishes. If I recommend a finish to the customer, it is one of the immersion finishes or OSP. Those finishes have the advantage of a flat surface to deposit paste. HASL has va

Re: HASL VS. OSP

Electronics Forum | Wed Jun 10 17:18:47 EDT 1998 | Igmar Grewar

| Okay, here's a stupid question. What exactly is HASL and OSP? We are going to delve into this technology where I work and I want to utilize the wealth of knowledge here to make life easier. Specifically, what are the differences, the advantages, di

Dendrite growth

Electronics Forum | Tue Feb 19 12:41:20 EST 2008 | patrickbruneel

Yes dendrites can cause electrical shorts. The first stage of dendritic growth is a dark fern like pattern which reduce surface insulation between anode and cathode. In a more advanced stage the ferns transfer the plating metals of the conductors and

Micro Leadless Frame - solder wetting control

Electronics Forum | Wed May 08 23:18:58 EDT 2002 | ianchan

Hi mates, have this SMT production issue : A) We have a leadless-chip-carrier(LCC) IC package that is classified under the Land-Grid-Array(LGA) package family. B) The LCC is 4mm x 4mm, and has 28 tin plated pads located beneath the outside perimet

Re: Gold boards OK with SMT? What About Gold Thickness? - Clarification

Electronics Forum | Wed Aug 12 07:22:52 EDT 1998 | Earl Moon

| | | | | Is there any problem using SMT on gold boards? 15 years ago we were told not to use gold boards, but I can't remember why. Judging by the other postings it now appears to be common. Only problem I see is that the nickel should be plated,

Re: BS

Electronics Forum | Mon Aug 28 12:41:35 EDT 2000 | JAX

MoonMan, I'll take a crack at the list. Feel free to answer the ones I don't! 1. Solderability is a parameter which indicates how well a component can be soldered. As far as Solder Termination Coatings go, here are some up�s and down�s of a few. Ha

Re: Unwetting leads of Palladium Plated Pins

Electronics Forum | Mon Mar 01 12:50:47 EST 1999 | justin medernach

| Hello! SMT professionals, | | I do not know if anyone posted this question before. | Last week, I reflowed our newly designed thin Rigid-Flex pcb with 0.040" thickness. I found all of pins of a TQFP48 ic did not get wetted. I could see on the hee

Solder Paste with/without silver

Electronics Forum | Thu Oct 18 18:39:15 EDT 2001 | davef

Responding to your questions ... RELIABILITY OF 1% SILVER SOLDER PASTE: It�s as good as the next solder paste, all other things the same. Look at your back articles by Jennie Hang in SMT magazine. I want to say she wrote an article on the topic i

Re: Bare Copper Pad Reflow Soldering

Electronics Forum | Fri Jul 30 16:02:49 EDT 1999 | Earl Moon

| | I received a request from customer to assemble ceramic substrate (alumina oxide)that printed with a low temperature Copper thick film conductor (the overglaze layer is polymer). The Copper pads are exposed without any coating. | | This ceramic su

OSP Handling

Electronics Forum | Fri Jun 27 10:27:59 EDT 2003 | davef

Since you�re asking the question about proper handling of OSP board, there may still be time to talk you out of using that material. * Cleaning of mis-printed board could cause non-wetting problems. This tends to remove a fraction of OSP coating. 0.3


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