We manufacture multi PCB up to 12 layer,The details of our capabilities:*Micro fine line to 4 mil *Blind & buried via hole *Flying-probe testing *Carbonlack *FR4 thickness: 0.3/0.4/0.8/1.0/1.2/1.5/2.0/2.4/3.2mm *Small quantities are available *Golden finger *HAL & chemical tin
Industry Directory | Manufacturer
professional manufacturer of pcb
Layer: 2 layer Materials: PI Copper Thickness: 35um Min Board Thickness: 0.1mm Surface coating: HAL, HAL LF, Immersion Gold, Immersion Tin, Immersion Silver PI thickness: 1/2mil, 1 to 10 mil ADH thickness: 1/2mil, 1mil FPC, flexible PCB OEM/OD
1-22 Layers PCBs FR-4, Rogers, High Tg FR4, CEM-1, CEM-3, etc. Material 0.4-6.0 mm Board Thickness Lead Free HASL, ENIG, Immersion Tin, Immersion Silver, OSP etc. Treatment Green, Red, White, Yellow, Black, Blue Solder Mask
Electronics Forum | Wed Aug 09 08:06:07 EDT 2006 | davef
See "IPC-4554 Specification for Immersion Tin Plating for Printed Circuit Boards" 3.2.1 Immersion Tin Thickness. The most common reason for solderability issues with the white tin surface coating during multiple thermal excursions is a thin white ti
Electronics Forum | Mon Aug 07 09:04:09 EDT 2006 | molos21
Hi everyone, I am starting to use the lead free process and I had a few wetting problems (solder did not reach top side) at the wave soldering process once the pcb had passed our smt line (one heat pass). From what I understand, I have had a problem
Used SMT Equipment | AOI / Automated Optical Inspection
BF-Frontier is used in the inspection of large-size printed circuit boards. In this device, the unique control sequence of software and hardware, accelerated scanning mode and stable optical illumination system can allow BF-Frontier to easily complet
Used SMT Equipment | AOI / Automated Optical Inspection
OMRON AOI VT-RNS2-L Omron AoiVT-RNSⅡ parameters Hardware part LSIZE Image signal input part Camera 3CCD camera Lighting series Ring LED (R.G.B) Image resolution 10, 15, 20um Mechanism part Transmission method Belt transmission method Producti
Industry News | 2020-01-29 07:33:26.0
IPC announces the winners of the IPC APEX EXPO 2020 Innovation Awards, a celebration of the innovators who are changing the technological landscape of the electronics industry.
Industry News | 2008-09-10 09:31:07.0
Saturn Electronics Corp. Providing Criteria for the Industry
Parts & Supplies | SMT Equipment
PCB Separator machine L100 Parameters: 1.maximum of board length: 200mm 2.board thickness:0.4~3mm 3.speed of sending board: it depends 4.material of knife:HSS 5.Volume:580mm(L) ×380mm(W) ×250mm(H) 6.weight:15kg Feature: 1.Minimize the inte
Technical Library | 2017-06-13 17:14:59.0
For tin-rich solder alloys, 200 C (392 F) is an extreme temperature. Intermetallic growth in tin-copper systems is known to occur and is believed to bear a direct relationship to failure mechanisms. This study of morphological changes with time at elevated temperatures was made to determine growth rates of tin-copper intermetallics. Preferred growth directions, rates of thickening, and notable changes in morphology were observed.Each of four tin-base alloys was flowed on copper and exposed to temperatures between 100 C and 200 C for time periods of up to 32 days. Metallographic sections were taken and the intermetallics were examined. Intermetallic layer thickening is characterized by several distinct stages. The initial growth of side plates is extremely rapid and exaggerated. This is followed by retrogression (spheroidization) of the elongated peaks and by general thick-
Technical Library | 2019-04-10 22:08:31.0
The stimulating impact of the automotive industry has sharpened focus on immersion tin (i-Sn) more than ever before. Immersion tin with its associated attributes, is well placed to fulfill the requirements of such a demanding application. In an environment dominated by reliability, the automotive market not only has very stringent specifications but also demands thorough qualification protocols. Qualification is ultimately a costly exercise. The good news is that i-Sn is already qualified by many tier one OSATs. The focus of this paper is to generate awareness of the key factors attributed to soldering i-Sn. Immersion tin is not suitable for wire bonding but ultimately suited for multiple soldering applications. The dominant topics of this paper will be IMC formations in relation to reflow cycles and the associated solderability performance. Under contamination free conditions, i-Sn can provide a solderable finish even after multiple reflow cycles. The reflow conditions employed in this paper are typical for lead free soldering environments and the i-Sn thicknesses are approximately 1 μm.
Flexible PCB Board Cutting Machine PCB Punching Machine With Cutomized Die Tooling PCB Punching Machine Features: 1. Depaneling PCB/FPC by means of punching dies, to avoid micro-cracks caused by manual. 2. Die toolings is changeable 3. Easy set
Suitable for cutting all kinds of PCB boards with V-cut, SMT circuit boards, aluminum boards, LED circuit boards, LED strips. Mainly used in the LED, SMT, mobile phone / mp3, electric toy, various electronic . please feel free to contact email addr
Events Calendar | Mon Sep 14 00:00:00 EDT 2020 - Mon Sep 14 00:00:00 EDT 2020 | ,
Printed Circuit Board (PCB) Inspection & Quality Control
Events Calendar | Thu Oct 21 00:00:00 EDT 2021 - Thu Oct 21 00:00:00 EDT 2021 | ,
Great Lakes Chapter Webinar: Low Melting Alloy & Selection of the Right Chemistry for Reliability
Career Center | Shen Zhen, China | Management,Sales/Marketing
Working in GLORYPCB for 10 years.knowing electronic supply chain very well. especially for PCB PCBA assembly and other Electronic Manufacturing Service.Glorypcb is a professional electronic manufacturer located in Shenzhen with three facilities.offe
Career Center | Houston, Texas USA | Engineering,Management,Quality Control,Technical Support
Seasoned Process & Quality Engineer. Degreed Chemical Engineer. 20+ years in Electronics Semiconductor manufacturing. Proficient in Quality Statistical tools, Design of Experiments, FMEAs, APQP, PPAP, ISO 9000, ISO/TS 16949 etc.
Effects of Tin and Copper Nanotexturization on Tin Whisker Formation SMTnet Express August 17, 2012, Subscribers: 25395, Members: Companies: 8952, Users: 33485 Effects of Tin and Copper Nanotexturization on Tin Whisker Formation First published
Influence of Pd Thickness on Micro Void Formation of Solder Joints in ENEPIG Surface Finish SMTnet Express December 13, 2012, Subscribers: 26067, Members: Companies: 9068, Users: 34058 Influence of Pd Thickness on Micro Void Formation of Solder
Imagineering, Inc. | https://www.pcbnet.com/capabilities/assembly/technology-roadmap/
begin your search Close Search • Technology Roadmap 2017 2018 2019 2020 Material • Taconic • MAGTRON • FR 4 • ISOLA • Polymide-Flex • Metal Core Min. Dieletric Thickness 2 mil Max
| http://www.szhonreal.com/productview.asp?id=37
< 100 ms Testing content The printing Whether, skewed, tin much less tin, open circuit, pollution Parts defects Lack of parts, migration, askew, made a, side made, turn over the pieces, polarity, wrong
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