Full Site - : tin whisker mitigation (Page 12 of 39)

Tin Whisker Risk Management by Conformal Coating

Technical Library | 2015-10-22 17:37:28.0

The objective of this study is to evaluate conformal coatings for mitigation of tin whisker growth. The conformal coatings chosen for the experiment are acrylic, polyurethane and parylene. Also included in this paper are tin whisker inspection results of tin-plated braiding and wire that was exposed to an environment of 50°C with 50% relative humidity for over five years.

Lockheed Martin Corporation

AEM Incorporated Invests in Hentec/RPS Photon Steam Aging System

Industry News | 2021-06-07 11:44:52.0

Photon steam aging system provides accelerated life testing simulating elongated storage conditions for high reliability applications.

Hentec Industries, Inc. (RPS Automation)

Next Best Thing to a Close Shave: Mitigating the Risks of Tin Whiskers

Technical Library | 2010-09-23 18:22:39.0

If you've been in electronics for any length of time, the phenomenon of tin whiskers is something you've likely heard discussed (maybe in scared whispered tones). Tin whiskers certainly aren't a new problem. In fact, some of the first published reports of the occurrence date back to the 1940’s and 1950's. But, over half a century later, we're still talking about it.

Henkel Electronic Materials

REL22 High Reliability Lead-Free Solder Alloy

REL22 High Reliability Lead-Free Solder Alloy

New Equipment | Solder Materials

AIM’s REL22™ alloy is comprised of tin, bismuth, silver, copper, antimony, nickel and trace amounts of elemental grain structure refiners. The alloy provides significantly improved durability for use in applications where thermal shock, vibration and

AIM Solder

Conformal Coating over No Clean Flux Residues

Technical Library | 2015-03-04 10:56:26.0

As the proliferation of modern day electronics continues to drive miniaturization and functionality, electronic designers/assemblers face the issue of environmental exposure and uncommon applications never previously contemplated. This reality, coupled with the goal of reducing the environmental and health implications of the production and disposal of these devices, has forced manufacturers to reconsider the materials used in production. Furthermore, the need to increase package density and reduce costs has led to the rapid deployment of leadless packages such as QFN, POP, LGA, and Micro-BGA. In many cases, the manufacturers of these devices will recommend the use of no clean fluxes due to concerns over the ability to consistently remove flux residues from under and around these devices. These concerns, along with the need to implement a tin whisker mitigation strategy and/or increase environmental tolerance, have led to the conundrum of applying conformal coating over no clean residues.

AIM Solder

New Yorker Electronics to distribute new Vishay Surface Mount Multilayer Ceramic Chip Capacitors

Industry News | 2021-01-26 11:24:31.0

New Vishay Vitramon MLCCs with Lead-Bearing Finish Termination Offer Tin Whisker Mitigation and Automotive Grade Reliability for Aerospace Applications

New Yorker Electronics

JEDEC and IPC Release Tin Whisker Acceptance Testing Standard and Mitigation Practices Guideline

Industry News | 2006-05-04 17:10:10.0

Documents to help manufacturers reduce the risk of tin whiskers in Pb-free products

iNEMI (International Electronics Manufacturing Initiative)

JEDEC and IPC Release Tin Whisker Acceptance Testing Standard and Mitigation Practices Guideline

Industry News | 2006-05-04 17:10:12.0

Documents to help manufacturers reduce the risk of tin whiskers in Pb-free products

iNEMI (International Electronics Manufacturing Initiative)

JEDEC and IPC Release Tin Whisker Acceptance Testing Standard and Mitigation Practices Guideline

Industry News | 2006-05-04 17:10:18.0

Documents to help manufacturers reduce the risk of tin whiskers in Pb-free products

iNEMI (International Electronics Manufacturing Initiative)

R&D Technical Services' David Suihkonen to Present on Vapor Phase Soldering – Reflow/ Rework Applications at SMTA International 2011

Industry News | 2011-09-23 21:12:22.0

R&D Technical Services. announces that David Suihkonen, President, will chair a technical session at the upcoming SMTA International Conference & Exhibition

R&D Technical Services, Inc.


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