Full Site - : tin whisker mitigation (Page 13 of 38)

ePAK International Purchases Hentec/RPS Photon Steam Aging System

Industry News | 2021-12-06 15:28:38.0

Photon steam aging system provides accelerated life testing simulating elongated storage conditions for high reliability applications.

Hentec Industries, Inc. (RPS Automation)

El Paso Industrial Supply Adds Hentec/RPS Photon Steam Aging System to Line-up

Industry News | 2021-09-20 11:06:13.0

Photon steam aging system provides accelerated life testing simulating elongated storage conditions for high reliability applications.

Hentec Industries, Inc. (RPS Automation)

Micross Components, Inc. Purchases Hentec/RPS Photon Steam Aging System

Industry News | 2021-11-09 10:43:21.0

Photon steam aging system provides accelerated life testing simulating elongated storage conditions for high reliability applications.

Hentec Industries, Inc. (RPS Automation)

Hentec/RPS Receives Order from Spirit Electronics for Photon Steam Aging System

Industry News | 2022-02-14 16:16:50.0

Photon steam aging system provides accelerated life testing simulating elongated storage conditions for high reliability applications.

Hentec Industries, Inc. (RPS Automation)

Indium Corporation's Technology Experts to Present at SMTA/iNEMI

Industry News | 2013-11-05 22:51:20.0

Indium Corporation's Dr. Ning-Cheng Lee, Vice President of Technology, and Dr. Ron Lasky, Senior Technologist, will present at the SMTA/iNEMI Medical Electronics Symposium November 13-14 in Milpitas, California.

Indium Corporation

Murrietta Circuits Offers Re-Tinning Services

Industry News | 2012-10-29 15:37:50.0

Murrietta Circuits now offers an entire menu of Re-Tinning capabilities

Murrietta Circuits

Circuit Technology Center to Increase Component Level Modification Services Capacity

Industry News | 2021-08-25 16:20:31.0

Two additional Hentec/RPS Odyssey 1325 RHSD machines will expand high reliability BGA alloy exchange and component re-finishing capabilities.

Hentec Industries, Inc. (RPS Automation)

Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow- Results of an Industry Round-Robin

Technical Library | 2017-10-12 15:45:25.0

The risk associated with whisker growth from pure tin solderable terminations is fully mitigated when all of the pure tin is dissolved into tin-lead solder during SMT reflow. In order to take full advantage of this phenomenon, it is necessary to understand the conditions under which such coverage can be assured. A round robin study has been performed by IPC Task group 8-81f, during which identical sets of test vehicles were assembled at multiple locations, in accordance with IPC J-STD-001, Class 3. All of the test vehicles were analyzed to determine the extent of complete tin dissolution on a variety of component types. Results of this study are presented together with relevant conclusions and recommendations to guide high reliability end-users on the applicability and limitations of this mitigation strategy.

Raytheon

Indium Corporation�s Dr. Ning-Cheng Lee and Dr. Ronald Lasky to Present at Lead-Free Workshop

Industry News | 2006-09-28 13:40:04.0

Indium Corporation�s Vice President of Technology, Ning-Cheng Lee, Ph.D., and Senior Technologist, Ronald C. Lasky, Ph.D., PE, will present at Implementing Lead-free: A Hands-on Workshop, October 16-19, 2006 at the Rochester Institute of Technology (RIT) Campus in Rochester, NY USA.

Indium Corporation

NPL to Host SMART Group Conformal Coating Event

Industry News | 2013-09-03 08:16:49.0

SMART Group announces that it will host “Improving Reliability with Conformal Coating” on Thursday, 24th October at the NPL facility in Teddington, London.

The SMART Group


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