Technical Library | 2017-10-12 15:45:25.0
The risk associated with whisker growth from pure tin solderable terminations is fully mitigated when all of the pure tin is dissolved into tin-lead solder during SMT reflow. In order to take full advantage of this phenomenon, it is necessary to understand the conditions under which such coverage can be assured. A round robin study has been performed by IPC Task group 8-81f, during which identical sets of test vehicles were assembled at multiple locations, in accordance with IPC J-STD-001, Class 3. All of the test vehicles were analyzed to determine the extent of complete tin dissolution on a variety of component types. Results of this study are presented together with relevant conclusions and recommendations to guide high reliability end-users on the applicability and limitations of this mitigation strategy.
Industry News | 2006-09-28 13:40:04.0
Indium Corporation�s Vice President of Technology, Ning-Cheng Lee, Ph.D., and Senior Technologist, Ronald C. Lasky, Ph.D., PE, will present at Implementing Lead-free: A Hands-on Workshop, October 16-19, 2006 at the Rochester Institute of Technology (RIT) Campus in Rochester, NY USA.
Industry News | 2013-09-03 08:16:49.0
SMART Group announces that it will host “Improving Reliability with Conformal Coating” on Thursday, 24th October at the NPL facility in Teddington, London.
Technical Library | 2012-08-16 22:38:05.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. The physical mechanisms behind tin whisker formation in pure tin (Sn) films continue to elude the microelectronics industry. Despite modest advances in whisker mitigation techniqu
Industry News | 2013-01-18 16:47:20.0
AIM Solder announces that its VP of Technology Karl Seelig will present his paper titled “Conformal Coating Over No-Clean Flux” at the upcoming IPC APEX Expo
Industry News | 2010-04-09 23:16:14.0
Continuing its efforts to provide the electronics industry with the most current and relevant research on life cycle engineering, CALCE holds semi-annual technical reviews to apprise Electronics Products and Systems Consortium members on CALCE research and project development.
Industry News | 2006-04-17 16:53:02.0
Event co-sponsored by iNEMI, the IEEE CPMT Society and ECTC
Industry News | 2019-01-12 07:53:43.0
Indium Corporation’s Dr. Ronald C. Lasky, Senior Technologist, and Jonas Sjoberg, Associate Director – Global Tech Services, will present at Pan Pacific Microelectronics Symposium 2019 (PanPac) in Kauai, Hawaii, USA, Feb. 11-14, 2019.
Technical Library | 2023-02-13 19:23:18.0
Spontaneously forming tin whiskers, which emerge unpredictably from pure tin surfaces, have regained prevalence as a topic within the electronics research community. This has resulted from the ROHS-driven conversion to "lead-free" solderable finish processes. Intrinsic stresses (and/or gradients) in plated films are considered to be a primary driving force behind the growth of tin whiskers. This paper compares the formation of tin whiskers on nanocrystalline and conventional polycrystalline copper deposits. Nanocrystalline copper under-metal deposits were investigated, in terms of their ability to mitigate whisker formation, because of their fine grain size and reduced film stress. Pure tin films were deposited using matte and bright electroplating, electroless plating, and electron beam evaporation. The samples were then subjected to thermal cycling conditions in order to expedite whisker growth. The resultant surface morphologies and whisker formations were evaluated.
Industry News | 2007-11-02 15:35:35.0
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