Industry News | 2006-06-23 16:19:47.0
Group Addresses Assembly Process and Reliability Requirements for SnPb and Pb-free Modules
New Equipment | Education/Training
The areas in which we are conducting research comprise a comprehensive group of inter-related issues and concerns involving all military, industrial and commercial electronics users facing conversion to lead free solder alloys. REI’s DoD currently
Industry News | 2010-02-23 16:29:14.0
The Center of Advanced Life Cycle Engineering at the University of Maryland in collaboration with The Institute of Scientific and Industrial Research (ISIR) at Osaka University is pleased to announce the call for participation for the Fourth International Symposium on Tin Whiskers.
Technical Library | 2023-02-13 19:14:03.0
Technology Focus: Develop and evaluate nanoparticle filled conformal coatings designed to provide long term whisker penetration resistance and coverage on tin rich metal surfaces prone to whisker growth in commercial lead-free electronics used in modern DoD systems. Research Objectives: Identify the fundamental mechanisms by which conformal coatings provide long-term tin whisker penetration resistance and inhibit nucleation/growth. Correlate mechanical properties and coverage thickness to whisker penetration resistance. Project Progress and Results: Functionalized nanosilica and non-functional nanoalumina enhanced polyurethane conformal coatings have shown improved spray coating coverage characteristics and crack resistance during thermal cycling fatigue testing. Lead-free assembly whisker mitigation validation testing is in process. Technology Transition: Current project partners provide coating materials to industry. SERDP test data will be considered during updates to the DoD adopted IPC standards for coating materials and coverage.
Industry News | 2013-11-08 18:26:23.0
AIM Solder announces today that Carlos Tafoya, International Technical Application Manager, is to present "Alternative Lead-Free Alloys for SMT Assembly" at the IPC Conference on Solder and Reliability: Materials, Processes and Tests, held November 13-14th, 2013 in Costa Mesa, CA. The presentation is scheduled on Wednesday, November 13 at 3:00 pm.
Technical Library | 2011-01-13 17:37:55.0
The tin whisker failures investigated in this paper were found on functional RoHS-compliant hardware. The samples were not conformal coated. This paper will document the conditions associated with the whisker formation under the following conditions; tin
New Equipment | Assembly Services
Perfectly Controlled Immersion Tin System The Horizon Stannatech system is the leading immersion tin system within the entire PCB industry. Together with the Stannatech process and Atotech's unique Crystallizer and ConStannic control systems for im
Industry News | 2010-05-05 21:42:51.0
OSAKA, JAPAN — Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that Keith Howell will present a paper titled “Effect of Soldering Method and Flux Type on Whisker Growth in SAC305” at the upcoming International Conference on Soldering and Reliability (ICSR), which is co-located with the Lead-Free Academy and SMTA Toronto Expo and Tech Forum.
Industry News | 2015-12-10 01:13:20.0
We are very pleased to help organise the NPL monthly webinars which are free to join and provide support to the industry world wide
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