Industry News | 2017-02-09 08:35:06.0
FARNBOROUGH, UK ― February 2017 ― Gen3 Systems Limited, a specialist British manufacturer and distributor, is pleased to announce that its Chief Technology Officer Dr Chris Hunt will present the paper titled “SIR intercomparison to validate the use of fine pitch pattern” at the upcoming IPC APEX EXPO. The presentation will be held during the session titled “SIR/Flux Reliability” on Tuesday the 14th February between 15:30 – 17:00pm in location 4.
Technical Library | 2019-05-01 23:18:27.0
Moisture can accelerate various failure mechanisms in printed circuit board assemblies. Moisture can be initially present in the epoxy glass prepreg, absorbed during the wet processes in printed circuit board manufacturing, or diffuse into the printed circuit board during storage. Moisture can reside in the resin, resin/glass interfaces, and micro-cracks or voids due to defects. Higher reflow temperatures associated with lead-free processing increase the vapor pressure, which can lead to higher amounts of moisture uptake compared to eutectic tin-lead reflow processes. In addition to cohesive or adhesive failures within the printed circuit board that lead to cracking and delamination, moisture can also lead to the creation of low impedance paths due to metal migration, interfacial degradation resulting in conductive filament formation, and changes in dimensional stability. Studies have shown that moisture can also reduce the glass-transition temperature and increase the dielectric constant, leading to a reduction in circuit switching speeds and an increase in propagation delay times. This paper provides an overview of printed circuit board fabrication, followed by a brief discussion of moisture diffusion processes, governing models, and dependent variables. We then present guidelines for printed circuit board handling and storage during various stages of production and fabrication so as to mitigate moisture-induced failures.
Industry News | 2009-07-28 11:43:13.0
OSAKA, JAPAN — July 2009 — Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that a new presentation about the challenges and issues in lead-free soldering is now available on the company’s Web site.
Industry News | 2011-09-12 12:59:41.0
Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, introduces the new Selector Guide for SN100C Flux-Cored Solder Wire.
Industry News | 2011-11-20 14:09:15.0
BTU International announces that Fred Dimock will present at the upcoming Lead-Free Electronics Workshop.
Industry News | 2012-01-24 20:35:41.0
AIM announces that Karl Seelig, Vice President of Technology, will discuss the reliability of lead-free alloys at the upcoming PB-Free Electronics Risk Management (PERM) Consortium Meeting, scheduled to take place January 31-February 2, 2012 in Arlington, Va.
Industry News | 2012-03-30 13:31:25.0
BTU International announces that Fred Dimock will present at the upcoming Optimizing Reflow of Lead-Free Boards and BGAs round table discussion hosted by EMSNow on Thursday, April 26 at 3:30 p.m.
Industry News | 2015-05-22 16:09:16.0
Reservations from overseas for delegate places and bookings for Table Top Exhibition space are already being received for the SMART Group European Conference & Exhibition, which will be held at the National Physical Laboratory (NPL), one of the UK’s leading science and research facilities based in Teddington, London, on the 22nd and 23rd September 2015.
Industry News | 2012-04-21 09:00:24.0
Nihon Superior, a supplier of advanced soldering materials to the global market is proud to announce that its President Tetsuro Nishimura has been invited to participate in a Roundtable discussion, “Optimizing Reflow of Lead-Free Boards and BGAs,” hosted by EMSNow.
Industry News | 2022-09-14 13:58:32.0
New Vishay Dale Series Delivers High Temperature Operation to 180°C Continuous with No Aging
