Technical Library | 2019-10-21 09:58:50.0
An ACI Technologies customer inquired regarding printed circuit board(PCB) failures that were becoming increasingly prevalent after the SMT (surface mount technology) manufacturing process. The failures were detected by electrical testing, but were undetermined as to the location and specific devices causing the failures. The failures were suspected to be caused predominately in the BGA (ball grid array) devices located on specific sites on this 16 layer construction. Information that was provided on the nature of the failures (i.e., opens or shorts) included high resistance shorts that were occurring in those specified areas. The surface finish was a eutectic HASL (hot air solder leveling) and the solder paste used was a water soluble Sn/Pb(tin/lead).
Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,
BGA & Area Array Failures, Causes & Corrective Actions Online Webinar
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Events Calendar | Thu Oct 21 00:00:00 EDT 2021 - Thu Oct 21 00:00:00 EDT 2021 | ,
Great Lakes Chapter Webinar: Low Melting Alloy & Selection of the Right Chemistry for Reliability
New Equipment | Education/Training
This hand soldering kit supports all Certified IPC Specialist (CIS) modules as well as the Certified IPC Trainer (CIT) instructional program for the IPC 7711C/7721C Rework, Repair and Modification of Electronic Assemblies Workmanship Certification. E
New Equipment | Education/Training
This hand soldering kit supports all Certified IPC Specialist (CIS) modules as well as the Certified IPC Trainer (CIT) instructional program for the IPC 7711C/7721C Rework, Repair and Modification of Electronic Assemblies Workmanship Certification. E
New Equipment | Education/Training
This solder training kit is an easy and effective training method that supports all Certified IPC Specialist (CIS) modules as well as the Certified IPC Trainer (CIT) certification program. Each kit contains two boards, HASL finish for tin-lead solder
New Equipment | Education/Training
This solder training kit is an easy and effective training method that supports all Certified IPC Specialist (CIS) modules as well as the Certified IPC Trainer (CIT) certification program. Each kit contains a board, HASL finish for tin-lead soldering
Our experienced engineers and technicians can craft processes that require a variety of surface mount technology (SMT) and plated through-hole (PTH) assembly techniques. ACI can assist manufacturers that require process development with solder alloy
