Used SMT Equipment | Soldering - Wave
1995 Astrapak Wave Solder Machine just decommissioned. Great condition for its vintage. Foam fluxer, preheat and Lamda Solder Wave, solder pot capacity 660LBS Machine is currently full of 63/37 tin/lead solder. Equipment can be serviced, powered
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Used SMT Equipment | Soldering - Wave
Vitronics Soltec Delta Wave 6622C, Manual in-feed slides, finger cleaner, Heavy Duty Transport Fingers, Finger Crash Detection, Light Tower Single Spray Nozzle (Beta Fog Nozzle 3.7), 2 Bottom Convection, 1 Bottom Cal Rod Heater, 1 Top side IR Heate
Used SMT Equipment | Soldering - Wave
New arrival Electrovert EPK Plus Wave Solder Machine, 208VAC 3 phase power, L to R Board Flow, Heavy Duty V and L finger mix, Manual Board Width Adjust , 16" Max Board Width, Finger Cleaner, Originally Configured with an internal Foam Flux
New Equipment | Solder Materials
95% Tin / 5% Antimony a.k.a. "Antimonial Tin" is a Lead solder replacement for soldering electrical equipment, Copper tubing, and cooling coils for refrigerators. Joints are of moderate strength where the higher strength and higher cost of KappZapp™
Lead Tinning is an important aspect when components need to withstand adverse conditions for extended periods. Lead Tinning can also be used in the restoration of corroded components to their original condition. V-TEK meets or exceeds Mil standards.
New Equipment | Solder Materials
AIM is a leading global manufacturer of tin-lead and lead-free solder paste and assembly materials for the electronics industry.
New Equipment | Assembly Services
Wire and cable harnesses. Pick and Place services. Through hole services. Soldering services, Tin/Lead & RoHS. Box build. Testing services. KanBan services. Logistics/Drop ship services. Repair services.
Technical Library | 2008-04-29 15:50:45.0
The electronics industry is undergoing a materials evolution due to the pending Restriction of Hazardous Substances (RoHS) European Directive. Printed wiring board laminate suppliers, component fabricators, and printed wiring assembly operations are engaged in a multitude of investigations to determine what leadfree (Pbfree) material choices best fit their needs. The size and complexity of Pbfree implementation insures a transition period in which Pbfree and tin/lead solder finishes will be present on printed wiring assemblies
Technical Library | 2014-03-06 19:04:07.0
Over the last few years, there has been an increase in the rate of Head-in-Pillow component soldering defects which interrupts the merger of the BGA/CSP component solder spheres with the molten solder paste during reflow. The issue has occurred across a broad segment of industries including consumer, telecom and military. There are many reasons for this issue such as warpage issues of the component or board, ball co-planarity issues for BGA/CSP components and non-wetting of the component based on contamination or excessive oxidation of the component coating. The issue has been found to occur not only on lead-free soldered assemblies where the increased soldering temperatures may give rise to increase component/board warpage but also on tin-lead soldered assemblies.
