Industry Directory | Manufacturer
The largest tin/lead secondary smelter in the western hemisphere, with a focus on recycling industrial metal waste streams. Areas of expertise include electronics dross, solder paste, solder wire, solder bar.
Industry Directory | Manufacturer's Representative
Dyfenco is specializing in R&D, manufacture and marketing a full range of Lead-Free and Tin-Lead solder products that are widely applied in the electronic, computer, PCB and Semi-conductor industries.
New Equipment | Education/Training
This hand soldering kit supports all Certified IPC Specialist (CIS) modules as well as the Certified IPC Trainer (CIT) instructional program for the IPC 7711C/7721C Rework, Repair and Modification of Electronic Assemblies Workmanship Certification. E
New Equipment | Education/Training
This hand soldering kit supports all Certified IPC Specialist (CIS) modules as well as the Certified IPC Trainer (CIT) instructional program for the IPC 7711C/7721C Rework, Repair and Modification of Electronic Assemblies Workmanship Certification. E
Electronics Forum | Wed Feb 20 08:13:21 EST 2002 | rkevin
When do you use Tin/Lead/Silver paste ? What is the advantage of using Tin/Lead/Silver paste comparing to Tin/Lead? Do you have to use Tin/Lead/Silver paste only if the components are made from Tin/Lead/Silver ? I would appreciate your quick resp
Electronics Forum | Wed Feb 20 09:38:47 EST 2002 | davef
Search the fine SMTnet Archives on � Sn62 � 62Sn � 2% Ag � 2% silver � 2Ag � etc re: "Do you have to use Tin/Lead/Silver paste only if the components are made from Tin/Lead/Silver ?" No Several points are: * Component leads with silver in the sol
Used SMT Equipment | Soldering - Wave
We offer for sale Vitronics SOltec wave soldering machines, ask for details, lead free and tin-lead also
Used SMT Equipment | Soldering - Selective
Make: Pillarhouse Model: Orissa Synchrodex 460 Selective Solder Vintage: 2014 Details: Drop Jet Fluxer Top Side Preheaters Used with 67/37 Tin Lead Solder 200-240V ~ 50/60HZ ~ 13KVA Max Nitrogen 5 Bar Air 6 Bar Condition: Complete & Operational
Industry News | 2003-02-17 08:40:25.0
To Meet Government Environmental Standards and Individual Company Policies, While Satisfying Production Requirements
Industry News | 2003-06-23 08:49:39.0
Three Organizations from the US, Europe and Japan to
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2020-06-02 15:16:51.0
A commercial systems manufacturer working on a major defense program contacted the Helpline for urgent assistance with an issue of failed parts during reliability testing. They were attempting to incorporate commercial off-the-shelf (COTS) computer-related hardware into a battlefield system and were experiencing reliability issues. It was noted that the parts were labeled by the vendor as "compliant to military (or MIL) standards" but not clearly identified as tin-lead or lead-free. ACI Technologies has supported a number of customers with lead-free issues and we assisted the customer in developing a short term and long-term solution to their problem.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Thu Jun 14 00:00:00 EDT 2018 - Fri Jun 15 00:00:00 EDT 2018 | ,
SMT Process Fundamentals for Tin-Lead and Lead Free Assembly - SMTA Webtorial
Events Calendar | Mon Sep 14 00:00:00 EDT 2020 - Mon Sep 14 00:00:00 EDT 2020 | ,
Printed Circuit Board (PCB) Inspection & Quality Control
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Impact of Reflowing A Pb-free Solder Alloy Using A Tin/Lead Solder Alloy Reflow Profile On Solder Joint Integrity If you don't see images, please visit online version at #Application.SmtNet.baseURL#/express/ The Impact of Reflowing A Pb
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Intermetallic Growth on PCB-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Reflow oven,SMT Reflow Soldering Oven 当前位置: Home >> News >> News Intermetallic Growth on PCB Intermetallic Growth on PCB Where the tin-lead solder adheres to the copper of the lead
