Electronics Forum | Tue May 13 08:26:29 EDT 2008 | davef
First, on your reflow temperature comment: The 183*C focus for reflow recipes for tin-lead solder is a falicy. If you held a recipe for tin-lead solder at 183*C peak, it would never reflow. Recipes for tin-lead solder need to be at liquidus plus 20*C
Electronics Forum | Tue Mar 07 14:18:32 EST 2006 | James
Billy, I have to disagree with you. We inadvertently soldered a Pb BGA with SAC305 paste and then had it micro sectioned and spectrum analyzed. Imagine our surprise when we saw the spectrum analysis showed Pb. The micro sections showed none to ac
Electronics Forum | Mon Mar 13 10:45:44 EST 2006 | muse95
The original issue was Co. does not need to go Pbfree, but some BGA's they use are only available Pbfree. They don't want to throw away Pb BGA stock, so some boards might have a combination of both Pb and Pbfree BGAs. The question basically was Shou
Electronics Forum | Wed Jun 02 05:40:35 EDT 2004 | johnwnz
Is there not an issue with reflowign the SAC ball's in term's of drivign up the lead contect in a lead free joint that increases the risk of failure in them? certainly dramatically increases voiding... have some pictures of soem that a customer tried
Electronics Forum | Tue Mar 07 14:23:21 EST 2006 | billyd
I think it has a whole lot to do with the heat applied, and the paste type. It was a seriously populated, very thick board, so we had to go big with the heat just to make 240-ish. That produced voids maybe 45 or 50% of the ball size. We knew immediat
Electronics Forum | Fri Mar 13 16:38:57 EDT 2009 | hegemon
'Hege is checking in for the DRS25 by Air Vac. Forced Air Convection reflow, and huge heating capacity for bottom side, ensuring minimum Delta T across the PCB during the process. Have 3 of these machines constantly in use for the last 2 and a half
Electronics Forum | Thu Oct 31 12:33:14 EDT 2013 | pbarton
You should have no difficulty with QFN or QFP parts when using non-RoHS solder. The QFP's are most likely to have tin plated leads and the metallisation on the QFN lands the same, or ENIG. Check the component part datasheets to verify the plating an
Electronics Forum | Thu Jan 16 03:43:42 EST 2003 | johnw
1st off for the forum folk, I don't like the fact that the new system only let's you see the posting your replying too, I'd rather be able to see the thread..... Anyhoo, why this alloy?, it's because it's the device manufacturers preferred and the c
Electronics Forum | Tue Feb 17 04:52:13 EST 2004 | John W
There's normally a number of reasons people want to know what melts 1st, 1 - to see if you know, 2 voiding issues - whole can of worms 3 device alignment. One of our collegues has said that most balls are Eutectic, that's in fact not totally correct.
Electronics Forum | Thu May 08 09:36:23 EDT 2008 | ck_the_flip
CSullivan, On the great SMTNet archives, there was much discussion about how to run in this scenario. Here is one such thread: http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=10483&#Message42337 Also, I wouldn't "
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