Electronics Forum | Wed Mar 29 15:37:44 EST 2006 | bga rosh in a tin lead process
should I expect any issue using a lead free BGA with tin lead paste and oven profile???
Electronics Forum | Mon Mar 06 22:30:12 EST 2006 | mainenetservices
We have a customer transitioning slowly to lead free due to necessity rather than a need to comply i.e. some of their BGAs can only be purchased Pb free only. So for this we would want to produce them a leadfree soldered PCB (not necessarly RoHS comp
Electronics Forum | Tue Oct 05 15:20:45 EDT 2010 | scottp
I agree that in consumer electronics there may be nothing wrong with using a lead free BGA in a SnPb process, but that blanket statement can't be made for the high reliability market.
Electronics Forum | Mon Oct 04 18:48:43 EDT 2010 | rsthompson
I am trying to assess current industry thinking on the question of whether or not lead-free BGAs (SAC or other) can or should be soldered in a tin/lead process. It seems there are differing opinions on this and I'm wondering what some of you are doin
Electronics Forum | Tue Oct 05 14:34:40 EDT 2010 | 18424
I am trying to assess current industry thinking > on the question of whether or not lead-free BGAs > (SAC or other) can or should be soldered in a > tin/lead process. It seems there are differing > opinions on this and I'm wondering what some of
Electronics Forum | Wed Oct 06 12:45:01 EDT 2010 | blnorman
I've seen studies were Pb-free BGAs in a leaded process have no reliability issues when a lead free profile is used. Pb-free profile ensure proper ball collapse and solder joint formation.
Electronics Forum | Fri Mar 26 10:35:52 EDT 2010 | grahamcooper22
Hi Krish, thanks for your detailed reply. Sorry I assumed you may be using a solder paste to solder the BGA to the pcb. Either solder paste or Gel flux is best for resoldering BGA to pcb. Are you using Gel flux ? Most popular long term storage for mo
Electronics Forum | Wed Oct 06 17:50:00 EDT 2010 | jamyboy
IBM Intel motorola did exhaustive studies on this and found that the best thing to do is (as others pointed out) the PBfree BGA reaches 217 minimum and the time above 217 must be extended to allow mixing of the 2 alloys. See attached a little diddy
Electronics Forum | Tue Oct 05 15:21:48 EDT 2010 | mikesewell
Nothing wrong with using RoHS BGAs except that the spheres won't melt/collapse at normal leaded reflow temps. Reliability will questionable. Some people use a hybrid profile with a slightly higher temp (~230C)and a slightly longer TAL (60 -90 sec).
Electronics Forum | Tue Jul 25 11:30:47 EDT 2006 | DC
Russ, we had similiar issue on the corner seperation. The board is ENIG and the part is Altera FBGA 1020 (Super BGA) and reflowed by tin/lead paste. Please comment your concern on Altera parts! Is CTE mismatch?
