Electronics Forum | Wed Oct 06 17:50:00 EDT 2010 | jamyboy
IBM Intel motorola did exhaustive studies on this and found that the best thing to do is (as others pointed out) the PBfree BGA reaches 217 minimum and the time above 217 must be extended to allow mixing of the 2 alloys. See attached a little diddy
Electronics Forum | Tue Oct 05 15:21:48 EDT 2010 | mikesewell
Nothing wrong with using RoHS BGAs except that the spheres won't melt/collapse at normal leaded reflow temps. Reliability will questionable. Some people use a hybrid profile with a slightly higher temp (~230C)and a slightly longer TAL (60 -90 sec).
Electronics Forum | Tue Jul 25 11:30:47 EDT 2006 | DC
Russ, we had similiar issue on the corner seperation. The board is ENIG and the part is Altera FBGA 1020 (Super BGA) and reflowed by tin/lead paste. Please comment your concern on Altera parts! Is CTE mismatch?
Electronics Forum | Thu Mar 01 11:47:20 EST 2007 | Wagoner
Run the lead free BGA side first. Then run the tin lead side second. We do this on some boards so that we don't overheat the components on the second side. There is no reason that the lead free solder needs to reflow on the second pass.
Electronics Forum | Thu Oct 07 07:58:29 EDT 2010 | scottp
The problem is there are also studies showing reduced reliability. Early thoughts were that if you got complete reflow of both solder materials then you'd be fine, but several studies have shown that there's something going on that's not well unders
Electronics Forum | Mon Oct 18 11:43:42 EDT 2010 | hegemon
Use the forums nice search feature above. "Lead Free BGA" Lots of info. In short it seems the general consensus is that you are pretty much safe using your lead free BGA in a tin lead process, provided you run your peaks a little higher, and your
Electronics Forum | Tue Jan 17 11:19:34 EST 2006 | Kris
Amol, RoHS does not apply to BGA on their own. Depends where they go in ? DVD player vs server board There is "solder exemption" for certain product applications. SnPb ball BGA can used with tin-lead solder on server/infrastructure/switch telecom
Electronics Forum | Fri Mar 26 09:00:19 EDT 2010 | krish_bala
Thank you Graham for the response. The particular BGA that we currently Bake is a Level 3 BGA, which means the BGA will expire in 7 days after removal. We are currently baking the BGAs once a week for the problem described above. These devices are u
Electronics Forum | Thu Oct 31 12:37:37 EDT 2013 | pbarton
You should have no difficulty with QFN or QFP parts when using non-RoHS solder. The QFP's are most likely to have tin plated leads and the metallisation on the QFN lands the same, or ENIG. Check the component part datasheets to verify the plating an
Electronics Forum | Mon May 19 08:18:22 EDT 2008 | davef
You should set the temperature at liquidus point of the solder used on the BGA plus 20 to 25*C. So, for tin-lead that would be ~215*C. Most lead-free solders run about ~20 to 25*C higher than that.
