Parts & Supplies | Pick and Place/Feeders
Supply&repair juki spare parts at l lower price: JUKI 710(720) CARRY UNIT E86127150B0 JUKI 710(720) CPU CARD E8601715AA0 JUKI 730(740) CARRY BOARD E86067210A0 JUKI 730(740) DC SERVO DRIVER E86037210A0 JUKI 750(760) AC SERVO CARD E86027210A0
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contact person:banny chen mail:zksale@hysmt.cn skype:miayuan8 40045136 LASER SENSOR CONTROLLER ASM E43197170A0 LASER SENSOR BASE ASM E90647170A0 LASER SENSOR CONTROLLER ASM. E9608717000 LASER SENSOR HEAD JUKI SPARE PARTS MODEL LIST JUKI
Parts & Supplies | SMT Equipment
contact person:banny chen mail:zksale@hysmt.cn skype:miayuan8 40045136 LASER SENSOR CONTROLLER ASM E43197170A0 LASER SENSOR BASE ASM E90647170A0 LASER SENSOR CONTROLLER ASM. E9608717000 LASER SENSOR HEAD JUKI SPARE PARTS MODEL LIST JUKI
Parts & Supplies | SMT Equipment
contact person:banny chen mail:zksale@hysmt.cn skype:miayuan8 40045136 LASER SENSOR CONTROLLER ASM E43197170A0 LASER SENSOR BASE ASM E90647170A0 LASER SENSOR CONTROLLER ASM. E9608717000 LASER SENSOR HEAD JUKI SPARE PARTS MODEL LIST JUKI
Industry News | 2021-08-13 08:33:52.0
Five Indium Corporation experts will participate in the SMTA South China Conference, Aug. 25-27, Shenzhen, China. This event is held in conjunction with NEPCON Asia 2021 at the Shenzhen Convention & Exhibition Center.
Parts & Supplies | Pick and Place/Feeders
JUKI 2050(2060) YB PULLEY BRACKET R ASSY PN:40000723 SHENZHEN GREEN TECHNOLOGY Company was found in 2003.we are specialized in the field of Industrial PC boards and Electronic controls Repair,and supply SMT/AI spare parts. Our company main busi
Electronics Forum | Wed Aug 06 16:35:31 EDT 2003 | Carol
This is an old topic, but keeps coming up. Solderability and reliability issues with SMT gold plated terminations when used with tin/lead solder paste/hassle finish PWB. I need to know which standard (mil, IPC, J-STD??) tells you all about the probl
Electronics Forum | Tue May 13 06:57:10 EDT 2003 | davef
Your vendor site is totally correct. 2Ag is an excellent solder, but it does nothing to prevent tin and gold from reacting chemically. An earlier poster is correct gold goes into solution in liquid solder very fast, less than a second. Gold and ti
Electronics Forum | Mon May 12 23:28:33 EDT 2003 | dehlers
To the best of my knowledge and experience the 2 % Ag component is not for embrittlement but rather to reduce gold scavenging caused by the propensity for tin to react with the gold. I have seen eutectic tin/lead actually disolve gold wire after a f
Electronics Forum | Wed Aug 06 20:50:42 EDT 2003 | davef
Well, if it "keeps coming up", let's take a pass at keeping down. For: * Requirement that gold be removed from components, pads, etc. is J-STD-001C, 5.4.1 * Context of that requirement [J-STD-001C, 5.4.1] and 6 or 7 references are in IPC-HDBK-001.
Main Products: 1. Original new and Original Used SMT/AI Spare Parts. 2. SMT Equipments And Related Machine( SMT Calibration, SMT Feeder Carts,Conveyer etc.) 3. Maintenace and Repair Service Pre-Sales Service Provide details ab
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