Industry News | 2021-08-30 16:05:36.0
Tom Baro will be on-site to discuss how Hentec/RPS selective soldering, lead tinning and solderability test equipment can improve your production quality.
Industry News | 2021-09-13 14:27:01.0
Tom Baro will be on-site to discuss how Hentec/RPS selective soldering, lead tinning and solderability test equipment can improve your production quality
Industry News | 2021-09-28 18:05:15.0
Tom Baro will be on-site to discuss how Hentec/RPS selective soldering, lead tinning and solderability test equipment can improve your production quality.
Industry News | 2021-10-11 15:51:16.0
Tom Baro will be on-site to discuss how Hentec/RPS selective soldering, lead tinning and solderability test equipment can improve your production quality.
Industry News | 2022-03-14 20:10:55.0
Tom Baro will be on-site to discuss how Hentec/RPS selective soldering, lead tinning and solderability test equipment can improve your production quality.
Industry News | 2022-04-04 19:21:58.0
Tom Baro will be on-site to discuss how Hentec/RPS selective soldering, lead tinning and solderability test equipment can improve your production quality.
Industry News | 2021-10-07 15:38:24.0
Averatek is pleased to announce that it will present a paper during the during the SMTA International Conference Nov. 1-4, 2021 at the Minneapolis Convention Center. Divyakant Kadiwala, Nazarali Merchant, Ph.D., and Benny Lam co-authored "Reliability of Solder Joints on Flexible Aluminum PC Boards."
Industry News | 2022-04-11 21:59:08.0
Tom Baro will be on-site to discuss how Hentec/RPS selective soldering, lead tinning and solderability test equipment can improve your production quality.
Industry News | 2016-03-03 08:27:28.0
Nordson MARCH has recently released a white paper showing the results of RF plasma processing on conformal coating adhesion, the conformity of the coating coverage, and the resulting effects on electrical functionality of a fully assembled printed circuit board. The research was done in conjunction with Nordson ASYMTEK, AirBorn Electronics, and SMART Microsystems (formerly known as Desich SMART Center). The paper can be downloaded at http://bit.ly/MARCH-PlasmaWP.
Technical Library | 1999-05-07 11:28:39.0
There are many things that can go wrong when soldering to gold plate over nickel surfaces. First of all, we know that gold and solder are not good friends, as any time solder comes into contact with gold, something seems to go wrong. Either the solder bonds to the gold and eventually pulls off as the tin and gold cross-migrate, leaving voids; or the solder completely removes the gold and is expected to bond to the metal which was under the gold.
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
