Electronics Forum | Sun Apr 05 00:23:53 EDT 2020 | researchmfg
1. To protect the nickel and copper under gold plating from oxidization before soldering. Gold plating can extend the PCB self-life and improve the solderability for 2nd re-flow. 2. Provide a good bonding strength. For Chip on Board process that Gol
Electronics Forum | Fri Nov 10 17:44:48 EST 2000 | Dave F
In response to your questions: Is the embrittlement from excess gold in lead / tin solder connections bad? It can be vereeee bad. Does it affect all plating processes the same? Give us a break and read the SMTnet Archives, for instance: BGA prob
Electronics Forum | Fri Oct 05 18:59:53 EDT 2001 | Dan Steffler
I have had an issue where solder has contaminated gold plated pads (fingers) where it is not acceptable. The pads must remain perfectly coplaniar for a LCD zebra strip to lay accross them. Does anyone know of a way to remove the marriage level of s
Electronics Forum | Fri Feb 28 11:02:06 EST 2020 | slthomas
I'm not 100% sure which type of gold you're asking about, but if you're talking about hard gold plating, I think the most common use is to provide a durable surface for things like membrane switch contacts because it resists abrasion and other mechan
Electronics Forum | Mon May 18 21:29:38 EDT 1998 | D.Lange
| I've tried every thing I can think of. Do you have any | Ideas? | What I have is micro balls on the gold fingers of | panelize boards. These balls only appear on the gold | finger. Or at least I can only find them on the gold | fingers. | What I
Electronics Forum | Tue May 19 12:54:55 EDT 1998 | Richard Jackson
| We had a similar problem. But whenever the solder came from the screen printer the solder would wet to the gold fingers, with the help of residual flux. But the problem is balls, that I assume are not wetted to the gold fingers but instead are jus
Electronics Forum | Tue May 19 12:29:59 EDT 1998 | Richard Jackson
| Richard, | You may be encountering solder paste contamination | on the assembly during the printing process. Solder | will reflow on tin/lead plated lands therefore invisible. | If you are washing the assembly prior to inspection | then you are
Electronics Forum | Tue May 19 10:23:06 EDT 1998 | Mike C
| Howdy Richard, | Welcome to the club! I now dub thee a full fledged member of the "Spotty Gold Finger and Bleeding Ulcer Society"...or SGFBUS for short... (GRIN) | I know it's not funny to be in that position, but there's so many different places t
Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
Electronics Forum | Thu Aug 06 09:51:20 EDT 1998 | Bob Willis
This text may be of interest to any one with tin lead spots Guide to Solder Spots - A New Plague in Manufacture ? So what are solder spots ? They appear to be the next big problem in modern reflow assembly in fact in any process that involves solder
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