Full Site - : tinning on gold plated contacts (Page 8 of 11)

Re: Immersion White Tin Process for PCB Finish

Electronics Forum | Fri Jan 14 07:55:07 EST 2000 | Pat Pepper

Hi Wolfgang, Thanks for the response. We had a similar situation to yours with some white tin samples that sat around for about eight months. Samples soldered right after they arrived soldered better than the ones we soldered eight months down the

Re: Wave solder edge covers

Electronics Forum | Wed Jun 30 12:14:40 EDT 1999 | John Thorup

| | We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design). I

Re: Wave solder edge covers

Electronics Forum | Wed Jun 30 11:38:05 EDT 1999 | Brian Conner

| We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design). Ins

pcb plating

Electronics Forum | Fri Jun 14 14:30:36 EDT 2002 | davef

Assuming you are talking about solderable surfaces: People specify various materials to protect the solderability of the pads on the board. Gold, actually, Electroless Nickel - Immersion Gold [ENIG], is popular. * Board fabricators like it because

Re: Wave solder edge covers

Electronics Forum | Fri Jul 02 10:06:17 EDT 1999 | John Thorup

| | | | We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design)

Re: Wave solder edge covers

Electronics Forum | Fri Jul 02 09:54:02 EDT 1999 | John Thorup

| | | | We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design)

Re: Soldering to Gold

Electronics Forum | Sat Sep 18 12:27:21 EDT 1999 | Earl Moon

| | | Dave, I'll respond by paragraph: | | | | | Brian: | | | | I like Ag2 also. I prefer it over both 63/37 and 60/40, if the price is not a factor. Yes, gold rips through eutectic and near-eutectic solders like habanero slathered shiitake

Re: Soldering to Gold

Electronics Forum | Sat Sep 18 04:42:52 EDT 1999 | Brian

Dave, I'll respond by paragraph: | | | Brian: | | I like Ag2 also. I prefer it over both 63/37 and 60/40, if the price is not a factor. Yes, gold rips through eutectic and near-eutectic solders like habanero slathered shiitake burritos through

Re: Soldering to Gold

Electronics Forum | Sat Sep 18 13:05:57 EDT 1999 | Brian

| | | | | | Dave, I'll respond by paragraph: | | | | | | | Brian: | | | | | | I like Ag2 also. I prefer it over both 63/37 and 60/40, if the price is not a factor. Yes, gold rips through eutectic and near-eutectic solders like habanero slath

Re: Soldering to Gold

Electronics Forum | Sat Sep 18 14:37:00 EDT 1999 | Earl Moon

| | | | | | | | | Dave, I'll respond by paragraph: | | | | | | | | | Brian: | | | | | | | | I like Ag2 also. I prefer it over both 63/37 and 60/40, if the price is not a factor. Yes, gold rips through eutectic and near-eutectic solders like


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