New Equipment | Rework & Repair Equipment
Conformal Coating Removal for Micro Abrasive Blasting Micro Abrasive Blasting helps remove conformal coating with precision avoiding any damage to the target circuit boards. This is so useful in semiconductor, electronics and medical industries. It
Career Center | Manhattan, Kansas USA | Production
Ultra Electronics, ICE is a leader in small aircraft aerospace systems and components. ICE secured its first contract in the aircraft industry in 1975 by designing and manufacturing a state-of-the-art deicer timer for Cessna Aircraft Company. ICE c
Industry News | 2021-08-27 11:46:08.0
New Yorker Electronics Releases the Barker Microfarads +105°C Tubular Axial Lead Aluminum Capacitors, a Mil-Spec Equivalent designed for Commercial Use
Industry News | 2022-04-28 14:12:06.0
The new YRM20, a premium high-efficiency, high speed modular mounter from Yamaha Motor Intelligent Machinery (IM), features an exceptionally High-Speed Rotary (RM) head) that achieves up to 115,000 Components Per Hour (CPH). It boosts high speed mount capability for the complete range of typical SMT devices, without the need to select several placement heads to cover the range of components being placed.
Industry News | 2018-07-17 14:02:04.0
Connected, “smart” wearables such as rings, bracelets, clothing and shoes are benefitting from tiny RF chip antennas that take up less PCB space and allow for more miniaturized devices
Industry News | 2014-07-09 10:22:05.0
Indium Corporation recently released RMA-155 Pb-Free Solder Paste. RMA-155 is the best solder paste for customers who are required to use RMA materials, but who need the performance benefits of modern Pb-free solder paste technology.
Industry News | 2019-01-12 07:49:38.0
SEHO North America today announced that Andreas Reinhardt, Ph.D., will present during Session S34, entitled, “Assembly/Emerging Technologies” during the IPC APEX EXPO. The presentation entitled, “Energy Efficient Reflow Soldering Process Using Embedded Carbon Layers” will take place on Thursday, Jan. 31, 2019 from 10:30 a.m. – 12 p
Industry News | 2011-01-18 13:46:21.0
Time and again, a major challenge lies in attaching integrated circuits (ICs) to highly integrated circuit board substrates in a space-saving manner. Würth Elektronik took this challenge on and found an ideal solution with the ESC (encapsulated solder connection) process. The chips are soldered and at the same time glued 'face-down" in their exact position.
