Industry News | 2015-09-30 16:26:02.0
Gen3 Systems Limited will exhibit both GEN3 Systems’ products and Optilia Inspection equipment in Booth #219 at the SMTA International Conference and Exhibition, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. Ascentech LLC also will participate in the SMTA International – National Physical Laboratory (NPL) Defect Database Live Solder Paste and Solder Joint Automatic Inspection Experience on the show floor. The experience is free to attend and is supported by CIRCUITS ASSEMBLY Magazine, SMTA and NPL.
Industry News | 2014-02-19 16:31:37.0
Gen3 Systems Limited will be exhibiting at IPC APEX EXPO alongside their American Distributor, Ascentech LLC, They will be present on Booth #2541 at the IPC APEX Expo.
Industry News | 2015-02-02 17:59:06.0
Gen3 Systems Limited today announced that it will exhibit at the IPC APEX EXPO alongside its North American Distributor Ascentech LLC. Gen3 Systems will be present on Booth #1028 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center, San Diego, and will introduce new and improved products for electronics manufacturing at the trade show.
Electronics Forum | Mon Apr 19 14:27:16 EDT 2010 | davef
Ralph Woodgate says that pump speed is the biggest driver to dross production
Electronics Forum | Thu Apr 22 09:39:08 EDT 2010 | baildl632
Davef, who is Ralph Woodgate?
Electronics Forum | Thu Apr 22 10:38:40 EDT 2010 | baildl632
Thanks! I've been re-inventing the wheel again!
Electronics Forum | Sat Apr 24 08:37:07 EDT 2010 | sudhir14
HI, Can pl. provide the some detail on recomanded pump speed
Electronics Forum | Thu Apr 15 09:34:00 EDT 2010 | sudhir14
Hi, Can any one help me for how to reduce the dross formation in wave soldeing process , currently we are getting very heavy dross formation in process
Electronics Forum | Mon Apr 26 10:29:49 EDT 2010 | davef
Set pump speed so that the board is 1/3 to 1/2 immersed as it goes through the wave.
Electronics Forum | Thu Apr 15 10:09:55 EDT 2010 | davef
Dross formation rates for SnCu and SAC are roughly 2.5 times the rate for SnPb (Hwang et al., 2004) Methods for reducing dross are: * Lower pot temperature * Run pump speed slower and only when soldering * Check solder contaminants to BS219, ASTM
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