Industry News | 2017-04-23 10:57:38.0
MicroCare Asia will use NEPCON Shanghai from 25-27 April as the platform in which to highlight three innovative new cleaning chemistries of the Tergo™ family: the Tergo™ Metal Cleaning Fluid, the Tergo™ Chlorine-Free Cleaning Fluid and the Tergo™ High-Performance Flux Remover.
Technical Library | 2010-07-08 19:56:15.0
As technology becomes increasingly reliant on electronics, understanding the reliability of lead-free solder also becomes increasingly important. This research project focused on phase transformation kinetics with the lead-free solder SAC 305. Today in the electronics industry, SAC 305 is the most widely used solder, making it a high priority to understand its long-term stability and performance in a variety of service conditions. Recent evidence has shifted the focus from thermal aging to reflow temperature and time above liquidus values during initial solder melting.
New Equipment | Solder Materials
8 hours), and abandon time (>4 hours) Printing: Suitable for high speed printing up to 150 mm/s Reflow: Solderable on challenging surface finishes (CuNiZn and Copper OSP) Colorless residues for easy post-reflow inspection Careful contr
Industry News | 2023-12-11 12:47:57.0
Altus Group has further enhanced its product portfolio with the addition of the ASSCON VP810 Vapor Phase Soldering System, the latest innovation in vapor phase technology launched at this year's Productronica trade fair in Munich.
Industry News | 2009-02-11 23:25:04.0
Despite today's challenging economic conditions, Rehm Thermal Systems' launch of the innovative VPS Condenso Vacuum system has triggered widespread interest throughout the industry. Demonstrated most recently in Japan at the Internepcon exhibition, the innovative system alone attracted more than 100 visitors from over 30 different companies.
Industry News | 2017-11-07 23:12:01.0
IBL Technologies, LLC announces the 15-year anniversary of Florian Wüst. Mr. Wüst began his career wiring and testing vapour phase machines at IBL and advanced to become the company's current Quality Manager.
Technical Library | 2022-02-16 15:34:32.0
Because of the phase-out of CFCs and HCFCs, standard solder pastes and fluxes evolved from RA and RMA fluxes to No-Clean, to low residue No-Clean, to very low residue No-Clean. Many companies came out with their cleaning solutions, aqueous and semi-aqueous, with each product release being more innovative than the previous one. Unfortunately for most of the suppliers of cleaners, two other trends appeared; lead-free soldering and the progressive miniaturization of electronic devices
Technical Library | 2014-03-27 14:50:01.0
Because of the phase out of CFC's and HCFC's, standard solder pastes and fluxes evolved from RA and RMA fluxes, to No-Clean, to low residue No-Clean, to very low residue No-Clean. Many companies came out with their cleaning solutions, aqueous and semi-aqueous, with each product release being more innovative than the previous one. Unfortunately for most of the suppliers of cleaners, two other trends appeared; lead-free soldering and the progressive miniaturization of electronic devices.
Industry News | 2009-12-14 21:11:59.0
DORSET, UNITED KINGDOM - December 2009 - Blakell Europlacer Ltd., a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces the addition of a range of new products to complement its existing product lines, distributed exclusively within the UK.
The Solderstar Pro - The only profiling datalogger you will ever need.
