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Henkel develops materials innovations for high power electronics

Industry News | 2012-04-27 19:07:14.0

Advances in power electronics are key to a sustainable energy future: Semiconductor power devices such as insulated gate bipolar transistors (IGBTs) deliver the high switching speeds which are critical for energy efficiency in electric cars, trains and other industrial applications. For the use of alternative energies, ultra-high efficiency and high-power density designs are imperative. Recognizing these market needs, Henkel has developed a comprehensive range of materials to further advance power electronics technology and will showcase these innovations from 8 to 10 May at SMT in Nuremberg.

Henkel Electronic Materials

MicroCare Europe Demonstrates Greener PCB Cleaning at Nuremberg Expo

Industry News | 2017-04-30 07:47:20.0

MicroCare Europe bvba will showcase a radically new cleaning chemistry at the SMT Hybrid Packaging Expo in Nuremberg, Germany from 16-18 May.

MicroCare Corporation

Valor Announces New Release of Trilogy 5000

Industry News | 2001-01-17 10:47:04.0

Valor Computerized Systems today announced powerful new functionality in release 6.0 of its Trilogy 5000 CAM software for virtual prototyping and assembly and test. This major release contains a number of significant new CAM productivity tools that strengthen Trilogy 5000's position as the best-in-class CAM system for global electronics manufacturing services (EMS) companies.

Valor Computerized Systems

TRI integrates ASSET�’s ScanWorks� boundary-scan technology into its test systems.

Industry News | 2008-04-22 21:10:46.0

Combining JTAG with ICT test systems delivers higher test coverage and reduces time-to-test

ASSET InterTech, Inc.

ASSETR Joins Mentor OpenDoor Program to ensure JTAG interoperability

Industry News | 2008-05-18 02:32:03.0

Richardson, TX (May 13, 2008) - ASSET InterTech (www.asset-intertech.com), the leading supplier of open tools for embedded instrumentation, has joined the Mentor Graphics OpenDoor Program in order to ensure toolset interoperability for embedded instrumentation applications. Through the program ASSET and Mentor will enable the exchange of data between Mentor's chip-level inserted design-for-test (DFT) structures, such as the JTAG infrastructure, and ASSET's ScanWorks platform, which automates, accesses and analyzes embedded instrumentation and DFT data.

ASSET InterTech, Inc.

Prices Slashed � Jovy Systems RE-7500 BGA Rework Station

Industry News | 2009-04-02 09:23:02.0

Economic woes � Chinese companies vie for increased sales

AVRepair, Inc.

Altus Present their Latest Equipment Solo for the First Time at Productronica Stand A2 132

Industry News | 2017-09-26 19:39:35.0

Altus Group, a leading distributor of capital equipment for the electronics assembly industry in the UK and Ireland will be ‘flying solo’ for the first time at Productronica, Munich from 14-17 November where they will present the latest capital equipment from some of the world’s leading manufacturers.

Altus Group

MicroCare Wins Prestigious Global Technology Award at Productronica 2017

Industry News | 2017-11-17 15:14:01.0

MicroCare Corp. has been honored for its expertise in critical cleaning with a Global Technology Award for the new halogen-free Tergo™ Chlorine-Free Cleaning Fluid. The award was presented at the impressive Productronica exposition in Munich. The award program is designed to honor the most innovative products and processes introduced by equipment makers and material suppliers serving the electronics assembly industry over the past year.

MicroCare Corporation

New LITTLE FOOT� Plus Driver Products for High- and Low-Side DC-DC Operation Integrate MOSFETs and Drive Circuitry in 10-mm by 6.2-mm Footprint

Industry News | 2003-06-11 13:37:07.0

With efficiencies better or comparable to competing implementations in the MLF/QFN/Power Block packages, these new devices in the LITTLE FOOT SO 16 feature a 38% or smaller standard footprint, simplifying design, assembly, soldering, and layout.

Vishay Intertechnology, Inc.

ATE China 2010 Set to Reenergize Growth of Electronics Assembly and Packaging Industry

Industry News | 2010-08-10 14:16:50.0

The Electronics Assembly and Packaging Technology Expo 2010 (ATE China 2010) will take place between August 31 and September 2 at the Shenzhen Convention & Exhibition Center. The expo will highlight various types of electronics assembly and packaging facilities, both locally and abroad. It also will offer technical solutions to assembly and production problems and allow buyers to identify new suppliers ― all of which will enhance competitiveness in the industry.

Reed Exhibitions - RX (Reed Exhibitions)


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