Full Site - : tombstone 0603 (Page 9 of 15)

Re: 0603 Tombstoning

Electronics Forum | Thu Feb 24 11:33:10 EST 2000 | Michael Parker

Thanks to all who responded. I am tending to believe oxidation is the root cause. I will be contacting the supplier to get definitive answer. Mike

Re: 0603 Tombstoning

Electronics Forum | Wed Feb 23 17:03:01 EST 2000 | CFraser

What machine are you using to place the components? I assume that you have checked placement prior to the refow process?

Re: 0603 Tombstoning

Electronics Forum | Wed Feb 23 21:38:26 EST 2000 | Dave F

Mike: I'm with you. The only variable is the component. Look for corrosion, uneven plating, or crud on one of the end-caps. Good luck. Dave F

Re: 0603 Tombstoning

Electronics Forum | Thu Feb 24 11:33:10 EST 2000 | Michael Parker

Thanks to all who responded. I am tending to believe oxidation is the root cause. I will be contacting the supplier to get definitive answer. Mike

Re: 0603 Tombstoning

Electronics Forum | Thu Feb 24 11:11:25 EST 2000 | Russ

I have seen this before, our problem was palladium termination of this component. We could not change suppliers so we use a "reverse homeplate" stencil design to put the majority of paste directly underneath the solder terminations of the component

Re: 0603 Tombstoning

Electronics Forum | Thu Feb 24 11:11:25 EST 2000 | Russ

I have seen this before, our problem was palladium termination of this component. We could not change suppliers so we use a "reverse homeplate" stencil design to put the majority of paste directly underneath the solder terminations of the component

Re: 0603 Tombstoning

Electronics Forum | Wed Feb 23 19:04:19 EST 2000 | Jason Nipper

Hi Mike, I have had problems in the past that were very difficult to determine the source of. Our tombstoning issues were caused by the plating on the part itself. If your smd placement, x-y positioning and placement pressure is not an issue, and

Re: 0603 Tombstoning

Electronics Forum | Wed Feb 23 21:37:31 EST 2000 | Morris

Michael: I would agree with Jason. It seems your analysis has pointed you to one specific brand of part. I've also seen this phenomenon. The part was Palladium plated and when we switched to a nickel/tin plated part, the problem went away. Some o

Re: 0603 Tombstoning

Electronics Forum | Wed Feb 23 19:04:19 EST 2000 | Jason Nipper

Hi Mike, I have had problems in the past that were very difficult to determine the source of. Our tombstoning issues were caused by the plating on the part itself. If your smd placement, x-y positioning and placement pressure is not an issue, and

Re: 0603 Tombstoning

Electronics Forum | Wed Feb 23 21:37:31 EST 2000 | Morris

Michael: I would agree with Jason. It seems your analysis has pointed you to one specific brand of part. I've also seen this phenomenon. The part was Palladium plated and when we switched to a nickel/tin plated part, the problem went away. Some o


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