Full Site - : tombstone reflow (Page 9 of 30)

Re: tombstones

Electronics Forum | Sat Jan 22 14:55:28 EST 2000 | Shravan Jumani

Jim, I am working with O2O1's, and I have found that a combination of No clean flux with Air Reflow, reduces tombstoning, wheras, a combination of No clean flux and Air increases it. Have you or anyone else experienced this? If you have any answers

Tombstone components issue after reflow?

Electronics Forum | Fri Aug 11 22:50:57 EDT 2017 | heros_electronics

Anyone who knows how to prevent such flaw? Tombstones are those lifted components from one sides. This results in costly and time-consuming amounts of touch-up and re-work after the assembly is completed. For the customers, this extra work translate

SMT defect pic or images

Electronics Forum | Wed Mar 02 09:28:02 EST 2005 | bobsavenger

I am looking for images of solder paste defects like Past stringing, paste gorging and dog ears. I would also like to have the avi file to show how tombstoning happens in the reflow oven. Thanks Bob

Tombstone components issue after reflow?

Electronics Forum | Wed Aug 16 14:36:06 EDT 2017 | duchoang

Not enough solderpaste. Uneven solderpaste volume on pads. Bad quality of caps ( Metal ends), try new cap manufacturer, sound weird, huh!! but that happened to me. Good luck.

Re: Tombstones

Electronics Forum | Fri Aug 07 10:14:43 EDT 1998 | RWW

| I'm currently running a double sided paste smt board loaded with 0603's, on the secondary side. Many of the 0603 devices tombstone during reflow if the parts are not perfectly centered on the pads. Is this caused by the .008 foil thickness? Has any

preheat slope vs ramp up- what is different?

Electronics Forum | Tue Jul 06 00:23:11 EDT 2010 | cksam

I am doing the case study of the component chip 0201 tombstoning problem. The significant causes was the reflow profiling preheat slope or ramp up rate. I really can't differential between preheat slope and ramp up rate. Could anyone here show me the

Solder balls

Electronics Forum | Tue Jul 20 02:36:03 EDT 2004 | yukim

Hi, The solder paste is SE5-M951X-9. Comparing with the previous one we used, we are having much more tombstoning problems. The reflow profile is such as: room temp to 140C: 85~95 sec 140 to 170 C: 80 sec 170 to 200 C: 20 ~ 23 sec Above 200 C: 44 ~

Re: Tombstoning of chip capacitors

Electronics Forum | Wed Aug 25 07:53:08 EDT 1999 | Scott Davies

| | Could use a little help here. Can anyone clarify to me the cause and fix of chip caps/resistors tombstoning following reflow? | | | | Any help would be appreciated. Thanks. | | | Most common reason is uneven heating where one side of the com

Re: Tombstoning of chip capacitors

Electronics Forum | Wed Aug 25 09:48:28 EDT 1999 | Larry Koens

| | | Could use a little help here. Can anyone clarify to me the cause and fix of chip caps/resistors tombstoning following reflow? | | | | | | Any help would be appreciated. Thanks. | | | | | Most common reason is uneven heating where one side

Re: Tombstoning of chip capacitors

Electronics Forum | Wed Aug 25 21:44:03 EDT 1999 | Jason Tomlinson

| | | | | | Could use a little help here. Can anyone clarify to me the cause and fix of chip caps/resistors tombstoning following reflow? | | | | | | | | | | | | Any help would be appreciated. Thanks. | | | | | | | | | | | Most common reason is


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