Electronics Forum | Fri Dec 08 18:37:01 EST 2000 | Dave F
Asymetry in heating or mechanical forces are the primary reasons for tombstoning regardless of the reflow method. [There's beaucoup of background in the fine SMTnet Archive on reflow tomstoning.] Your situation is curious, but at least you know why
Electronics Forum | Sat Jan 29 23:55:58 EST 2005 | KEN
I recently ran a process evaluation (Print/ P&P /Reflow) and was plesently surprised with a 5.0 sigma process or 250ppm. Attrition was under 1%. Keep in mind this is defects counted Post-reflow. The most signifficant defect was tombstoning / draw-
Electronics Forum | Thu Feb 24 10:29:27 EST 2000 | Shravan Jumani
Iam doing some work with O2O1s and am facing tombstoning problems. From screening experiments I find that a N2 reflow results in more number of tombstones than in Air. Would appreciate anyones inputs on why this happens, or how I should tackle the pr
Electronics Forum | Thu Feb 24 10:29:34 EST 2000 | Shravan Jumani
Iam doing some work with O2O1s and am facing tombstoning problems. From screening experiments I find that a N2 reflow results in more number of tombstones than in Air. Would appreciate anyones inputs on why this happens, or how I should tackle the pr
Electronics Forum | Thu Jun 11 05:22:37 EDT 2009 | phanviet
Dear all, Plz help me. We are running main board for LCD monitor. Some chip capacitor near QFP have tombstone. We try to adjust soak time for Reflow Oven, Adjust XY coordinate, Adjust solder paste amount...But problem still there. Thank for your supp
Electronics Forum | Tue Nov 30 15:38:27 EST 1999 | Wendy Casker
Hi, I am looking for land patterns for 0612 and 0508 chip capacitors. Because they are not standard (yet) package sizes, i am having trouble finding a standard land pattern. (If you don't know what these are, picture a 1206 or an 0805 with the te
Electronics Forum | Wed Aug 25 16:42:32 EDT 1999 | Dave
| | | | | | Could use a little help here. Can anyone clarify to me the cause and fix of chip caps/resistors tombstoning following reflow? | | | | | | | | | | | | Any help would be appreciated. Thanks. | | | | | | | | | | | Most common reason is
Electronics Forum | Mon May 03 09:42:45 EDT 1999 | Mike McMonagle
| Tombstoning 0805s w/palladium/platinum/silver terminations | | We are experiencing tombstoning problems on 0805 packages that have paladium/platinum/silver terminations. It comes & goes...... | | I�ve checked the reflow profile, and paste deposi
Electronics Forum | Mon Aug 14 12:46:41 EDT 2017 | deanm
Any of the comments so far could be valid. To add my opinion, it looks like the pad size is too large. A smaller volume of solder will pull less than a larger volume. If you can't change the pad sizes, then the next thing to try is to get another ste
Electronics Forum | Thu Aug 24 00:05:14 EDT 2017 | heros_electronics
The first reply from Tsvetan Usunov already > answered your question - there are no thermals > for one side of the chips. > > You can try to > reduce the phenomenon by using different solder > pastes, tuning your soldering profile or even > swi
