Electronics Forum | Fri Jun 24 15:37:24 EDT 2005 | KT
Also check for any Vian-in-pad designs that could cause the problem.
Electronics Forum | Fri Apr 17 10:44:29 EDT 2009 | rmitchell
Hi, follow up, Thanks to everyone that responded. We finished the build, the sun burst thru the clouds and the birds sang. Well that was a slight exageration. Sorry for lack of detail on the original post, I was frazzled. Since the 0201's were p
Electronics Forum | Thu Jun 02 14:50:41 EDT 2005 | techknow..
Placement looks good...paste to pad coverage good..correct profile used and verified by tracker. The problem being that this one cap is tombstoning at the same place every time. The placement is central. The part is near the edge at the break off.
Electronics Forum | Tue Jun 14 18:37:18 EDT 2005 | GS
On top to above suggestions,Round pad designe (where possible to get) helps to solve tombstoning pbm. Regards GS
Electronics Forum | Thu Jun 02 17:24:19 EDT 2005 | PWH
Could also be a ground plane under one of the terminations of the cap causing heat sink troubles during reflow. One pad liquifies/solidifies before the other. Don't know a good solution for this outside of reworking them.
Electronics Forum | Tue Jun 14 17:25:29 EDT 2005 | peter ng
the pcb pad design problem?(the component able to fully located at the pad?).....or maybe the component(cap)problem?try to exchanged the part and reverse the pcb direction of the reflow entering.
Electronics Forum | Tue Jun 21 08:03:32 EDT 2005 | mapell
Curious... are you running any N2 in your reflow? If so what ppm level? I have worked with some reflow users that low ppm levels (
Electronics Forum | Wed May 09 15:15:52 EDT 2001 | caldon
Your process needs some refining. How long did it take to wet? How much force did it take to break the surface tension? What type of solder was in the solder pot? What type of flux was used? What was the pot temperature? Did you take a cap and p
Electronics Forum | Thu May 10 09:57:22 EDT 2001 | zam_bri
Hi Cal/Dave F, Good news today. The problem went away when I received and ran with a brand new component today. But I'm sure with a robust profile, I should be able to compensate oxidations at some degrees, rite? ( taking into consideration the suc
Electronics Forum | Wed Jan 10 20:06:43 EST 2007 | SSS
I've been assembling thousands of boards for dozens of customers over the past 5 years with 0402 chip components. 85% can happen very easily even with newer equipment. Defect challanges with 0402 packages is almost always tombstoning. Capacitors abou
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