Fast automatic inspection and high performance sample testing in one system. Two inspection concepts in one system - The best of two worlds. In modern SMT production, components such as BGA, QFN or QFP are gaining ground. Because their connectors a
Manual and semi-automatic μCT inspection systems for small electronic components with measurements of voxel sizes around 15 – 20 μm. The XCT-1000 series systems meet the most stringent demands in CT X-ray. With this Computed Tomography system, Matri
Saki's automated high-resolution 3D X-ray inspection and measurement systems enable high image quality defect detection. Saki's systems are based on reliable hardware design, superior reliability, safety, and ease of maintenance, and are backed by a
Industry News | 2003-07-10 08:14:46.0
Until today non-destructive testing with high-resolution computed tomography has only been feasible with immense constructions in larger scientific laboratories. phoenix|x-ray is now closing this technological gap offering a highly resolving CT system for a broad public - the brand new v|tome|x (pronounce: vee-tomex). This novel system is capable of producing a detailed three-dimensional radioscopic visualisation of the sample that can be inspected from all angels in tomographic slices and sections. In contrast to the customary X-ray 2D projection methods computed tomography can display overlapping parts separately. In particular, for long objects this means that the cross-section becomes accessible at any position along the axis.
Technical Library | 2014-06-12 16:40:19.0
Occurrence of popcorn in IC packages while assembling them onto the PCB is a well known moisture sensitive reliability issues, especially for surface mount packages. Commonly reflow soldering simulation process is conducted to assess the impact of assembling IC package onto PCB. A strain gauge-based instrumentation is developed to investigate the popcorn effect in surface mount packages during reflow soldering process. The instrument is capable of providing real-time quantitative information of the occurrence popcorn phenomenon in IC packages. It is found that the popcorn occur temperatures between 218 to 241°C depending on moisture soak condition, but not at the peak temperature of the reflow process. The presence of popcorn and delamination are further confirmed by scanning acoustic tomography as a failure analysis.
WASET - World Academy of Science, Engineering and Technology
Technical Library | 2019-01-30 21:20:47.0
Due to the arrayed nature of the Computed Tomography (CT) Detector, high density area array interconnect solutions are critical to the functionality of the CT detector module. Specifically, the detector module sensor element, hereby known as the Multi-chip module (MCM), has a 544 position BGA area array pattern that requires precise test stimulation. A novel pogo-pin block array and corresponding motorized test socket has been designed to stimulate the MCM and acquire full functional test data. (...) This paper and presentation will focus on the socket design challenges and also key learnings from the design that can be applied to general test systems, including reliability testing. The secondary focus will be on the overall data collection and graphical user interface for the test equipment.
Technical Library | 2023-11-20 17:30:11.0
Summary for today 1. Electronic component inspection and failure analysis. 2. Component counting and material management. 3. Reverse engineering. 4. Counterfeit detection. 5. Real-time defect verification. 6. Computed tomography (CT) techniques and how to differentiate between 2D, 2.5D, and 3D x-ray inspection. 7. Design for manufacturing (DFM) and design for x-ray inspection (DFXI). 8. Voids, bridging, and head-in-pillow failures in bottom terminated components (BTC). 9. Artificial Intelligence and x-ray inspection
Industry Directory | Consultant / Service Provider / Manufacturer
Matrix Technologies designs and builds advanced off-line and in-line x-ray inspection systems for solder joint and final assembly test inspection. Matrix uses 2D, 2.5D, SFT and 3D X-ray techniques with advanced defect detection
Industry Directory | Manufacturer
Shuttle Star Technology designs and builds advanced off-line 2.5D&3D x-ray inspection systems for solder joint and final assembly test inspection in SMT&EMS. It uses world-class X-ray techniques with advanced defect detection.
Manual and semi-automatic ?CT inspection systems for small electronic components with measurements of voxel sizes around 15 -- 20 ?m. Depending on customer requirements the system can equipped with the most suitable x-ray tube and detector.
