Industry Directory | Manufacturer
Pillarhouse is a leading supplier of selective soldering systems for single-point and multi-point soldering configured for manual loading, in-line or as multiple unit in-line systems offering topside and in-line preheat.
Industry Directory | Consultant / Service Provider / Manufacturer
Designer & Manufacturer of Acoustic Microscopes for Nondestructive Component Inspection.
New Equipment | Selective Soldering
Setting the standard! All-in-one inline selective soldering machine for increased productivity, reliability, and ultimate flexibility. High quality, flexibility and reliabilty offered in a complete all-in-one package is what you get with the inline
3550 sq. mm second (> 5.5 sq. in / second) Maximum Board Size: 350mm x 250mm (14 x 10 in.) Minimum Board Size: 50mm x 50mm (2 x 2 in.) Topside Clearance: 25mm (1 in.) Bot
Electronics Forum | Mon May 29 10:30:19 EDT 2006 | Marc
All, What method does everyone use for measuring the heat on the topside of the board in a Wave- we are currently using temp stickers. If the Flux is activated at between 110-120 degrees Celcius does this mean that the topside should read around 90
Electronics Forum | Mon Nov 12 16:10:46 EST 2001 | davef
There is no doubt that we reflowed topside BGA on our wave solder machine. We run our wave pot at 450�F and that�s plenty hot enough to reflow solder on topside SMT components. When the solder balls on the BGA melt, the package is over 200�C, trust
Used SMT Equipment | In-Circuit Testers
Features: Including Windows 7 Pro OS Large board ability to accept up to 25"W x 26"L boards Four topside moving probes IC Opens TOS4 Inspection (2) adjustable bottoside probes
Used SMT Equipment | In-Circuit Testers
2005 Seica Pilot Flying Probe Tester O/S: Windows XP S/W: Viva 2.3.2.10 Top-Side Probes: 4 "Mobile" Bottom-Side Probes: 8 "Fixed" Power: 110VAC; 30A; 1 Phase or 230VAC; 14A; 1 Phase Air: Minimum = 73.5 PSI Machine Dimensions: 53" x 48
Industry News | 2003-07-02 08:54:26.0
A novel unreinforced, thermally conductive, pressure sensitive adhesive tape delivers very high bond strength to low-energy surfaces.
Industry News | 2020-04-14 18:49:39.0
EAE, the Electronic Assembly Equipment division of ITW is the proud recipient of an IPC APEX 2020 New Product Innovation (NPI) Award. The award recognizes the Electrovert DwellFlex 4.0 wave solder nozzle.
Parts & Supplies | Chipshooters / Chip Mounters
FUJI CP6 COUPLER K1005Z 700313 SCREW M4X10 BUTT.HD ST.ST 700118 SCREW M5X25 CAP HD ST.ST 171262 THUMBSCREW^^^TOPSIDE 171261 CLAMP^BRACKET^^ 171260 CARRIER^CASSETTE^SC 171215 CHASSIS^CAS^350SC^HMOUNT 171130 HOOK 137965 METAL E
Parts & Supplies | Chipshooters / Chip Mounters
700689 WASHER M5 BLACK PLASTIC 700404 SCREW M4X6 CSK.SLTD.M/C ST.ST 700402 SCREW M3X8 CSK.SLTD.M/C ST.ST 700401 SCREW M3X6 CSK.SLTD.M/C ST.ST 700313 SCREW M4X10 BUTT.HD ST.ST 700118 SCREW M5X25 CAP HD ST.ST 171299 CARRIER^CASSETTE
Technical Library | 2017-02-16 16:53:49.0
This experiment considers the reliability of a variety of different electronic components and evaluates them on 0.200” power computing printed circuit boards with OSP. Single-sided assemblies were built separately for the Top-side and Bottom-side of the boards. This data is for boards on the FR4-06 substrate.This paper was originally published by SMTA in the Proceedings of SMTA International.
High speed, in-line, multi-platform selective soldering system Incorporating high-speed PCB transfer, the Orissa Fusion platform offers the ultimate in flexibility, coupled with reduced line length at a lower cost compared to current market offering
Events Calendar | Fri Jan 11 00:00:00 EST 2019 - Fri Jan 11 00:00:00 EST 2019 | Richardson, Texas USA
SMTA Dallas Chapter - Understanding Selective Solder Technology
Lewis & Clark | http://www.lewis-clark.com/product-tag/ace/
: • Two Pots, Lead Free and Lead “Interchangeable Pots” • Nozzles • Boardsize 2×2 up to 18X24 • Topside Preheat • Spray fluxer Condition
1st Place Machinery Inc. | http://www.firstplacemachinery.com/first_place_smt_pcb_aoi_mvp.html
. Through-hole components pre-or post solder and wave for presence / absence, bent, under pins, solder presence, and bridging. Topside inspection also includes IC orientation and polarity