Electronics Forum | Fri Mar 30 11:02:58 EST 2001 | slthomas
Surprise, surprise. ;) Wouldn't think of it.... Yep. I'm not as concerned about two flux chemistries mixing and causing a substrate China syndrome as I am about the OA flux retained in voids and subsequently released in a touchup operation. If w
Electronics Forum | Tue Oct 27 02:59:02 EST 1998 | Jeff Sanchez
| I'm trying to find a source for a tilt device for use when doing touch-up soldering. Employee needs to raise the board above standard bench height for better access to the board and for better posture. Angle of the tilt device should be adjustabl
Electronics Forum | Wed Mar 02 18:46:02 EST 2005 | Austinj
The tendancy always has been "when in doubt, touch it up"... this is not the way to "verify the process" and is not the best strategy for multiple reasons (unessecary rework, additional labor costs, as well as making the solder joint more brittle, [i
Electronics Forum | Thu Mar 03 09:04:26 EST 2005 | russ
Been following this thread and have a question, Why do "touch-up" people follow different criteria than "Q.C." people. It sounds like the root of the problem is not addressed but bandaids are being put into place. We have no "Q.C." department and
Electronics Forum | Tue Oct 26 14:11:25 EDT 1999 | Dave F
Gary: Two things: 1 Reworking golding fingers is an old topic, check the SMTnet archives to get started. 2 Gold fingers should not be discoloring, unless: * You are doing something bad to them ... OR * Your supplier has doinked the process, which
Electronics Forum | Mon Apr 13 12:07:58 EDT 1998 | Tim Velardo
Wondering if anyone has information on percentage of components that we can expect to "lose" during our SMT process. We are new to SMT, using QUAD machines and feel we are losing to many parts during our process. We are spending a lot of touch-up ti
Electronics Forum | Fri Feb 11 09:44:01 EST 2005 | pjc
A touched-up solder joint is never as reliable as one soldered correctly by machine. Touching up adds more heat thereby increasing the thickness of the intermetalic bond. Our goal is to have the thinest intermetalic bond in our solder joints. The int
Electronics Forum | Tue Mar 01 10:55:07 EST 2005 | spot
A lot depends on the complexity of the board/process as well as the amount of placements. If the board has few placements and the parts are not smaller that 0805 then doing all the rework after completion is ok. The human eye can only pick out obvi
Electronics Forum | Thu Sep 15 17:55:18 EDT 2005 | slthomas
Are they worried about the top side SMDs too, or just the bottom side? If it's just the bottom, maybe you can just glue them without reflowing. That way they won't be at risk of cracked solder fillets after AI. Granted, you'll probably be glueing pa
Electronics Forum | Fri May 12 12:07:10 EDT 2006 | solderiron
The kester better known as KY'd Sn/Cu has more copper intermetallic growth over time, dissolves copper from the board faster so repairing and touchup can damage board. Bridges more than SN100c. Does not thermal cycle well. Has shrink cracks that can
