Full Site - : transducers dont agree (Page 20 of 40)

software to produce assembly programs

Electronics Forum | Wed Nov 07 12:58:20 EST 2007 | Frank

I agree with Jon, that using Gerber data is a pain in the butt, but that doesn't answer your question about what software to use. CircuitCAM, VALOR, UniCAM (now Tecnomatix), and GC Place are the more popular third party software packages that deal d

Auto stencil printer or AOI

Electronics Forum | Wed May 16 01:06:38 EDT 2012 | bwjm

Hi Before I say anything I ll qualify who I am. I > work for a AOI/SPI manuafacturer > > Automatic > printer is your best option for small > runs. Print process is responsible for a vast > number of solder defects and improving here is > your b

paste quality

Electronics Forum | Thu Feb 13 19:08:31 EST 2014 | darby

Have to agree with Sr Tech and Spoilt - you'd have to really mistreat your paste these days for it to be the root cause. However, try another paste to eliminate that; making sure you abide by the suppliers specs. Pad design, stencil design,(includin

Stencil life

Electronics Forum | Fri Aug 17 07:04:30 EDT 2018 | buckcho

I agree with you. I just said, if it is customer requirement, factory has to implement it, right? :) Of course it is huge amount of money. SPI is the main control, but it doesnt save you the pressure, speed, snap of from the printer to the trace (us

Re: Off Pad Printing

Electronics Forum | Tue Jun 29 16:03:57 EDT 1999 | Dave F

snip | John and Dave, | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on considerable research (as others of us did in the past), to do things like placing 0603's on 0402 pad

Solder Paste Volume

Electronics Forum | Thu Mar 29 15:29:11 EST 2001 | johnw

measuring Paste volume or at least paste height is an essencial part of any SMT process. You've got to control those input's.... Paste volume determines how much solder is available for your joint so theres a direct to joint reliability / PCB reliabi

Multi-part reeling for pick and place

Electronics Forum | Fri Jul 16 13:41:24 EDT 2004 | Frank

I agree with everybody here. There are plenty of better options than what you have proposed. Without knowing your equipment brand, or what type of offline software you have, if any, I have a few suggestions. 1) If you don't have any offline softwa

The story so far!

Electronics Forum | Thu Jan 18 15:50:41 EST 2007 | samir

Hi Patrick, I agree, there've been many anomolies this Winter. I've spent the last 6 months at my company's Chicago branch, and temperatures throughout December were very comparable to the desert heat of Riyadh! I hate Al Gore, the guy's a total to

Looks like we'll be BGAing in the near future

Electronics Forum | Wed Jan 30 14:11:15 EST 2008 | slthomas

We dodged it for a while but it was inevitable. Here's the question. What do I REALLY need, and does anyone even agree on it? OK, that's *two* questions. The first board we're likely to do has three parts that will need special consideration. One

Re: vibration during solder reflow

Electronics Forum | Mon May 24 09:52:06 EDT 1999 | john thorup

| | | Has anyone had any experience or data using vibration during the reflow process. | | | We introduced a vibration device attached to the fixed rail on a Vitronics reflow oven. The reason was to prevent skewing on large PLCC devices. The process


transducers dont agree searches for Companies, Equipment, Machines, Suppliers & Information