Full Site - : transfer (Page 3 of 386)

Altium CAM System and Free ODB++ Viewer Bridge Gap Between PCB Design and Manufacture

Industry News | 2003-03-11 08:45:00.0

CAMtastic DXP is the latest version of Altium's complete CAM verification and editing system that bridges the gap between PCB design and manufacturing and facilitates communication between board designers, fabrication engineers, and their clients.

SMTnet

Altium Gives New DXP Technologies to P -CAD Users

Industry News | 2003-06-20 08:54:22.0

Service Pack 1 for P-CAD 2002 released today

SMTnet

Electronics Workbench Announces Multisim 7 and Multicap 7 for Professional Circuit Engineers and Designers

Industry News | 2003-05-06 09:05:12.0

New Schematic Capture and Simulation Software Delivers Innovative Features and the Industry�s Best Price/Performance

SMTnet

REMEC Deploys AWR Design Flow Worldwide

Industry News | 2003-06-09 09:16:38.0

The adoption of AWR EDA software supports REMEC�s continuous efforts to manage the substantial challenges of today�s wireless design technology.

SMTnet

Photronics Names John Chin Vice President - Asia

Industry News | 2003-07-09 09:00:46.0

He will have responsibility for all aspects of Photronics� manufacturing and sales activities in China, Singapore and Taiwan.

SMTnet

MIRTEC ACCEPTS ITS 20TH INDUSTRY AWARD AT PRODUCTRONICA 2013

Industry News | 2013-11-13 14:25:15.0

MIRTEC, “The Global Leader in Inspection Technology,” announces that it was awarded a 2013 Global Technology Award in the category of Inspection – AOI for its MV-9 2D/3D CoaXPress In-Line AOI Series.

MIRTEC Corp

KEMET Announces Enhanced Strategic Plan

Industry News | 2003-07-10 08:36:25.0

To execute this strategic plan, KEMET is reorganizing its operations around the world.

SMTnet

MIRTEC to Display the 'World's Most Technologically Advanced' 3D AOI System at Productronica 2023

Industry News | 2023-10-16 12:50:01.0

MIRTEC announces the release of their All-New ART Hybrid 3D AOI System at Productronica 2023. The World's leading trade fair for the electronics manufacturing industry will take place Nov. 14-17, 2023, at the Trade Fair Center Messe München, Germany. All are welcome to MIRTEC's Booth #461 in Hall A2 for a detailed demonstration of what will undoubtedly be recognized as the World's Most Technologically Advanced 3D AOI System!

MIRTEC Corp

Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

SMTnet

Hot Off Record Breaking Q1, MIRTEC Europe to Exhibit at SMT/Hybrid/Packaging

Industry News | 2016-04-17 21:30:50.0

MIRTEC, “The Global Leader in Inspection Technology,” announced that MIRTEC Europe had a record breaking first quarter and has high expectations for the months to come. Also, MIRTEC will display its award-winning 3D AOI and SPI Inspection Systems in pc tec’s booth, Hall 7A, Stand 504, at the upcoming SMT/Hybrid/Packaging show, scheduled to take place April 26-28, 2016 at the Messe in Nuremberg, Germany.

MIRTEC Corp


transfer searches for Companies, Equipment, Machines, Suppliers & Information

Pillarhouse USA for Selective Soldering Needs

Training online, at your facility, or at one of our worldwide training centers"
Sell Used SMT & Test Equipment

High Throughput Reflow Oven
IPC Training & Certification - Blackfox

World's Best Reflow Oven Customizable for Unique Applications
Electronics Equipment Consignment

High Resolution Fast Speed Industrial Cameras.
Voidless Reflow Soldering

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...